ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/products/x-ray-inspection-systems?con=t&page=10
voiding, fill level, overlay and other critical dimensions. SMT Nuremburg Nordson DAGE Russell Byrne from Nordson DAGE will be presenting at the Exhibitor Forum on the subject of
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/footprint-expert-2021-08-released_topic2931.html
– fixed an issue with the “Pad on Assembly” outline was going to the Silkscreen Layer. Calculator Component Families: Grid Array’s (BGA, LGA, CGA, PGA) – fixed an issue with rectangular shape packages
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/topic2931&OB=ASC.html
– fixed an issue with the “Pad on Assembly” outline was going to the Silkscreen Layer. Calculator Component Families: Grid Array’s (BGA, LGA, CGA, PGA) – fixed an issue with rectangular shape packages
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic2931&OB=ASC.html
– fixed an issue with the “Pad on Assembly” outline was going to the Silkscreen Layer. Calculator Component Families: Grid Array’s (BGA, LGA, CGA, PGA) – fixed an issue with rectangular shape packages
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/topic2078&OB=DESC.html
!! NEW / ENHANCED: Calculator: Chip – added a new component family for Antenna – ANTC When selecting the Red indicator light in the viewer a new message appears and the OK button updates the Data Added alpha-numeric pin text in the thumbnail pictures for BGA, LGA, CGA and PGA 3D STEP
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic2078&OB=DESC.html
!! NEW / ENHANCED: Calculator: Chip – added a new component family for Antenna – ANTC When selecting the Red indicator light in the viewer a new message appears and the OK button updates the Data Added alpha-numeric pin text in the thumbnail pictures for BGA, LGA, CGA and PGA 3D STEP
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/high-strain-rate?con=t&page=18
. Products Content Your results for: High Strain Rate X-Ray / Bondtester Reliability Study of BGA Devices – Impact of Interfacial Voiding Nordson DAGE X-ray Dose DataSheet (Japanese
Baja Bid | https://bajabid.com/wp-content/uploads/2023/06/XT-V-130-flyer-EN.pdf
. An image intensifier and digital camera are used to capture patterns of X-rays that pass through the specimen, showing different shades of gray depending on material and geometry
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/products/bondtesters?con=t&page=6
. The second generation 4000 Plus bondtester continues to be the most advanced bondtester on the market whilst the 4000 Optima is optimized for fast, accurate and reliable bondtesting in the volume manufacturing environment
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/footprint-expert-2021-09-released_topic2951.html
– Gang Solder Mask Shape had a bug issue that affected solder mask shape on SMD pads. Calculator Component Families: All Grid Array’s (BGA, CGA & LGA) – setting the local Calculator solder mask in
COT specializes in high quality SMT nozzles and consumables for pick and place machines. We provide special engineering design service of custom nozzles for those unique and odd components.
2481 Hilton Drive
Gainesville, GA USA
Phone: (770) 538-0411
