Microwave Plasma System for assembly cleaning prior to wirebond, attach, encapsulation, and underfill.
Industry Directory | Manufacturer
Contract Manufacturer for MOTOROLA Cellular Transceivers; GWCOM Internet Adapters; K&S WireBonders; Finisar; Hewlett Packard Printers
Industry Directory | Manufacturer
Ceramic and organic packaging and package assembly. Flip Chip, Wirebond, Lidding for a wide range of devices and applications from power semiconductors, ASICs, to complex modules.
Wire-bonding Technician: Capable of programming, repair and support automatic K&S 1419 wire bonders and MECH-EL /MEI manual bonders, among with other assy equipment. Familiarity with HYBRID assemblies in a semiconductors environment. SPC knowlege.
Industry Directory | Consultant / Service Provider
Since 1987, American Dicing Inc. has offered high precision dicing and scribing, die binning, sorting and tape & reel, die bonding and wirebonding services with competitive pricing and leadtimes.
Industry Directory | Manufacturer
Wafer Dicing, Die Attach, Wirebond, Glob Top, Semiconductor Packaging, RF Assemblies, SMT, PCB Assembly, Chip-on-Board, Multi-Chip Modules, Die Stacking, Flipchip, Stud Bumping, Prototyping, Process Development, Proof of Concept.
Industry Directory | Consultant / Service Provider
Cadwerx provides superior pcb layout, interactive autorouting, and schematic capture
Industry Directory | Manufacturer
Nepes offers flip chip solutions ranging from wafer bumping to advanced packaging and testing for IC manufactures, module electronics and end-product makers.
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