Technical Library: 2020 2020 adaptor (Page 5 of 11)

Smart and Connected Bioelectronics for Seamless Health Monitoring and Persistent Human-Machine Interfaces

Technical Library | 2020-06-10 01:42:55.0

Recent advancement of flexible wearable electronics allows significant enhancement of portable, continuous health monitoring and persistent human-machine interfaces. Enabled by flexible electronic systems, smart and connected bioelectronics are accelerating the integration of innovative information science and engineering strategies, ultimately driving the rapid transformation of healthcare and medicine. Recent progress in the development and engineering of soft materials has provided various opportunities to design different types of mechanically deformable systems towards smart and connected bioelectronics.

Georgia Institute of Technology

Selection of PCB Materials for 5G

Technical Library | 2020-08-05 18:41:32.0

With the first 5G NR standard recently approved by the 3GPP at the end of 2017, many companies are racing to design 5G radio products that will demand wider bandwidths, higher frequencies, enhanced carrier aggregation and support of massive MIMO. AT&T and Samsung plan to launch 5G mobile services and Verizon plans to launch 5G Fixed Wireless Access in the US this year while South Korea will be demonstrating 5G at the upcoming Winter Olympics.

Rogers Corporation

An Engineer's Guide to Testing and Evaluating The Performance of Desiccant Bags for the Protection of Critical Moisture Sensitive Devices

Technical Library | 2020-08-16 14:50:25.0

Not all desiccant bags are created or perform equally. Performance measures include: a) How long does desiccant last? b) How much are can be desiccated in a given area? c) How much moisture is retained, and or released back into the atmosphere? This article walks engineers through various test they can perform to determine efficacy. Additionally, the article highlight between adsorption vs adsorption.

Steel Camel

Silicone Thermally Conductive Grease: Improving Thermal Management of Electronic Assemblies

Technical Library | 2020-09-30 19:26:45.0

Introduction •Market trend: Smaller, more efficient, more powerful, run faster •ICs and other sophisticated electronic components typically operate efficiently only under a certain range of temperatures •Operational temperatures must be kept within a suitable range • Excessive heat can damage performance and can even cause system failure

Dow Electronic Materials

Keep Your Business Going Even In the Lockdown Through A CRM Solution

Technical Library | 2020-10-08 07:05:21.0

You are afraid of losing your business during this global COVID-19 crisis. But now, you got a ray of light to bring back your firm on track without breaking the bank. You must be thinking that how CRM software can provide you the juices that you require to sustain your business.

FinCRM Technologies

FRACTURE TOUGHNESS OF THERMALLY CONDUCTIVE ADHESIVES

Technical Library | 2020-10-14 14:18:13.0

Thermally conductive adhesives provide many advantages over traditional mechanical fastening techniques. Specifically, they use less material and space and are more amenable to automation than existing solutions. The thermal and mechanical properties of these materials are well understood but little work has been done to characterize and understand their toughness and fracture behavior. This paper presents the effects of filler loading as well as matrix composition on the fracture toughness of thermally conductive silicone adhesives. It was observed that the fracture toughness of these materials increased significantly with initial filler loading, and that the mechanical properties and fracture toughness depended on the molecular architecture of the matrix used.

Henkel Electronic Materials

Realization of a New Concept for Power Chip Embedding

Technical Library | 2020-10-18 19:31:27.0

Embedded components technology has launched its implementation in volume products demanding high levels of miniaturization. Small modules with embedded dies and passive components on the top side are mounted in hand held devices. Smartphones have been the enablers for this new technology using the capabilities of embedded components. With this technological background another business field became interesting for embedded components – the embedded power electronics. The roadmap of the automotive industry shows a clear demand for miniaturized power electronic applications. Drivers are the regulations for the international fleet emissions which are focusing on three major trends.

AT & S Austria Technologie & Systemtechnik Aktiengesellschaft

Reliability Challenges in Fabrication of Flexible Hybrid Electronics for Human Performance Monitors: A System Level Study

Technical Library | 2020-11-10 15:43:25.0

Flexible hybrid electronics (FHE) interface rigid electronic components with flexible sensors, circuits, and substrates. This paper reports the reliability improvement of a FHE Human Performance Monitor (HPM), designed to monitor electrocardiography (ECG) signals.

Stanford University

Designing a High Performance Electroless Nickel and Immersion Gold to Maximize Highest Reliability

Technical Library | 2020-11-15 21:22:11.0

The latest highest reliability requirements demand a high performance electroless nickel and immersion gold (HP ENIG). The new IPC specification 4552A has refocused the industry with reference to nickel corrosion. The interpretation of the existing specification, that judges corrosion on 3 levels, is complex and if misinterpreted can lead to phantom failures. An obvious way to avoid any potential misinterpretation is to eradicate any evidence of corrosion completely.

Atotech

Troubleshooting the STM32F429 board and restoring its operation

Technical Library | 2020-11-19 10:15:54.0

How to repair boards if they have been produced for a long time, and the documentation is lost? In this case, intelligent recognition systems can help, which will allow you to identify component pins without documentation for the board. In this article, we will find the STM32F429 board malfunctions without any documentation and in the least amount of time.

Engineering Physics Center of MSU


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