Technical Library | 2018-04-27 13:23:31.0
When performing BGA component rework, it is important to know the actual heat that is coming out of the top and bottom heaters. This will be critical in setting up accurate heat profiles. Monitoring your heat output will also keep you aware of your heaters performance so that you will know when the heaters need to be replaced.
Technical Library | 2013-08-14 14:06:48.0
This paper discusses how to successfully profile a printed circuit board when reworking Ball Grid Array and Chip Scale Packages.
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