Technical Library | 2007-12-27 11:41:37.0
The latest screen printing platforms unlock more of the potential from dual-lane processing. Simultaneous demands to enhance flexibility while increasing utilisation and overall throughput apply to manufacturers operating at virtually any point in the mix-volume continuum: capacity must work hard to deliver the required return. As these lean manufacturing principles hold sway from the US and Europe to the Far East, no modern assembler has a second to spare.
Technical Library | 2007-12-13 17:03:02.0
Printer-hosted processes for solder ball placement are now widely used for package technologies ranging from BGAs using ball diameters above 750μm to the latest WL-CSPs demanding 250μm diameter. This broadening spectrum of applications brings more choices in terms of stencil design rules and production methodologies.
Technical Library | 2007-09-27 16:18:15.0
Considerable interest exists in the process known as the pinin- paste, or the Alternative Assembly and Reflow Technology (AART) process. The AART process allows for the simultaneous reflow of both odd-form and through hole devices as well as surface mount components. This process has several advantages over the typical mixed technology process sequence that includes wave soldering and/or hand soldering, often in addition to reflow soldering.
Technical Library | 2008-12-18 01:34:49.0
Unless you've been living under a rock the past several years, you are no doubt keenly aware of the global drive toward alternative energy sources. Certainly this initiative is attractive because of the clear environmental benefits of developing fossil fuel substitutes, but also because of potential economic benefit. Although fuel cell technology has been proven viable for various applications, the production costs still remain relatively high, and further process development to promote low-cost, high-volume manufacturing is required to reach a price point that encourages widespread consumer acceptance.
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