Technical Library | 1999-04-26 11:52:34.0
An evaluation of two fluxers, one with a reciprocating ultrasonic head and the other with microjets, was performed using nine independent criteria. The paper describes the methods of testing and the results.
Technical Library | 2016-08-02 06:10:56.0
As the technology has become a universal key to major developments, the marine and boat industry has shown elevated growth in recent time. The marine market circumscribes on the electronic and design solutions for every single innovation. All the developments in Marine sector has and are heading towards a notion of modernization and among these, printed circuit board is grounding the research and developments. How to increase the efficiency of the device? How to gain optimum fuel efficiency? Does the dual fuel concept become a buzz word for major innovations? These are the basic questions which are considered to bring new novelties in the market.
Technical Library | 2014-08-19 16:04:28.0
SMT assembly planning and failure analysis of surface mount assembly defects often include component warpage evaluation. Coplanarity values of Integrated Circuit packages have traditionally been used to establish pass/fail limits. As surface mount components become smaller, with denser interconnect arrays, and processes such package-on-package assembly become prevalent, advanced methods using dual surface full-field data become critical for effective Assembly Planning, Quality Assurance, and Failure Analysis. A more complete approach than just measuring the coplanarity of the package is needed. Analyzing the gap between two surfaces that are constantly changing during the reflow thermal cycle is required, to effectively address the challenges of modern SMT assembly.
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