Technical Library | 2023-01-17 17:37:45.0
Various international market trends drive electronics manufacturers and their mate- rials and equipment suppliers to develop new assembly techniques to reduce the industry's environmental impact. Two pri- mary forces in this drive are the movements to lead-free assembly and ISO 14000 cer- tification. In response to these factors, reflow technology advances are enabling manufacturers to meet or anticipate the new environmental mandates.
Technical Library | 2017-12-07 10:35:50.0
Electronics manufacturers protect their circuit boards with conformal coatings. Conformal coatings serve as a barrier from environmental hazards and internal shorts, tin whiskers, and corrosion at the board level. Within conformal coatings different material chemistries specialize in shielding from an array of hazards and can be applied by multiple methods. The most common method is atomized spray which disperses the material into a fine mist. Alternatively, non-atomized coating controls the materials' dispense shape while maintaining the original liquid form. While some applications demand atomized spray and other scenarios overlap between atomized and non-atomized coating, this paper focuses on the circumstances where materials are ideally suited for non-atomized, selective coating.
Technical Library | 2023-12-18 11:33:57.0
Elevate your electronic manufacturing game with the I.C.T-D600 SMT Dispensing Machine! Precision, safety, and efficiency in one powerful solution. In the dynamic realm of electronic manufacturing, precision and efficiency are not just preferences but essential requirements. Introducing the I.C.T-D600, an automatic glue dispenser machine engineered to enhance production processes across various applications. From chip encapsulation to PCB assembly, SMT red-glue dispensing, LED lens production, and medical device creation, SMT dispensing machine is a versatile solution tailored to meet the demands of the industry. Essential Attributes Of The I.C.T-D600 Automatic Glue Dispenser Machine 1. Compliance with European Safety Standards: The I.C.T-D600 SMT dispensing machine prioritizes not only efficiency but also safety, boasting compliance with European safety standards and holding a CE certificate. This ensures a secure and reliable manufacturing environment, aligning with global quality benchmarks. 2. International Component Quality: Internationally renowned components form the core of the D600 SMT dispensing machine. From Panasonic servomotors to MINTRON CCD, each element is carefully selected, guaranteeing high performance and durability. This commitment to quality components results in a machine that operates seamlessly, reducing downtime and maintenance costs. 3. Impressive Performance Metrics: The SMT dispensing machinedoesn't just meet expectations; it surpasses them with exceptional performance metrics: Maximum Guide Rail Speed: 400mm/s Fastest Injection Valve Speed: 20 spots/sec Dispensing Accuracy: ±0.02mm Repeated Accuracy: ±0.01mm Machine Characteristics: Core Part – Jet Valve The non-contact jet dispensing method ensures high-speed operation (max jet speed: 20 spots/second), high accuracy with a minimum dispensing volume of 5nl, and flexibility with extremely small dispensing volumes. The thermostatic system for the flow channel and sprayer ensures uniform glue temperature, resulting in low maintenance costs and an extended service life. Enhanced Capacity: Non-contact jet dispensing eliminates the need for Z-axis motion. Integrated temperature control technology reduces manual intervention. Automatic glue compensation minimizes artificial regulation time. Dual-track design reduces waiting time. Automatic visual location identification and compensation. Non-contact height detection with laser reduces height detection time. Flexibility: Capable of handling substrates or backings of various sizes. Optional heating module. Independent control of dual tracks with user-friendly software. Fast switching between different product lines. Universal platform suitable for various processes with different glues
Technical Library | 2010-01-13 12:34:10.0
Micro-sectioning (sometimes referred to as cross-sectioning)is a technique, used to characterize materials or to perform a failure mode analysis, for exposing an internal section of a PCB or package. Destructive in nature, cross-sectioning requires encapsulation of the specimen in order to provide support, stability, and protection. Failures that can be investigated through micro-sectional analysis include component defects, thermo-mechanical failures, processing failures related to solder reflow, opens or shorts, voiding and raw material evaluations.
Technical Library | 2021-09-21 20:36:45.0
The present paper gives an overview of surface failures, internal nonconformities and solders joint failures detected by microscopic analysis of electronic assemblies. Optical microscopy (stereomicroscopy) and Fourier-Transform- Infrared (FTIR) microscopy is used for documentation and failure localization on electronic samples surface. For internal observable conditions a metallographic cross-section analysis of the sample is required. The aim of this work is to present some internal and external observable nonconformities which frequently appear in electronic assemblies. In order to detect these nonconformities, optical microscopy, cross section analysis, FTIR-microscopy and scanning electron microscopy with energy dispersive spectrometry (SEM-EDS) were used as analytical techniques.
Technical Library | 2012-05-17 21:53:39.0
First published in the 2012 IPC APEX EXPO technical conference proceedings. Companies that have initiated internal resources to obtain compliance data have realized that collecting, and more importantly, maintaining the currency of that data requires more
Technical Library | 2013-10-13 10:54:13.0
The measurement of the conformal coating thickness on a printed circuit board (PCB) to ensure internal and international standards are met is now a critical factor in conformal coating process control. There are several methods for measurement of conformal coating thickness and they fall into two categories. These categories are wet film measurements applied during coating application and dry film measurements made after the coating is dried enough not to damage the coating.
Technical Library | 2016-09-22 17:52:59.0
Conformal Coatings are often used to increase the reliability of electronic assemblies operating in harsh or corrosive environments where the product would otherwise fail prematurely. Conformal coatings are often qualified to international standards, intended to enable users to better differentiate between suitable conformal coating chemistries, but always on a flat test coupon, which is not representative of real world use conditions. In order to better correlate international standards with real world-use conditions, three-dimensional Surface Insulation Resistance (SIR) test boards have been manufactured with dummy components representative of those commonly used on printed circuit assemblies...
Technical Library | 1999-07-20 11:00:12.0
It's quite common for a power supply (PSU) designer to work with a circuit designer to realize a system design compliant with international EMC regulations. PSU designers will be well aware of the requirement of the power supply to provide clean DC voltage and not disturb the AC mains voltage. However, they may not have any idea of the noise that can potentially be introduced to the mains through the PSU by the target circuit. Likewise, the circuit designers (digital or analogue) may not know what attenuation the PSU will provide.
Technical Library | 2009-04-30 18:06:24.0
This presentation surveys the most significant via and via-related laminate failure mechanisms from past to present using data from current induced thermal cycling (CITC) testing, failure analysis, and other sources. The relative life and failure modes of thru vias, buried vias, and microvias (stacked vs. non-stacked) are compared, along with the affect of structure, materials, and peak temperatures on the above. The origin of via-induced laminate failures such as "eyebrow cracks" and Pb free related internal delamination is also explored.
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