Technical Library | 2023-12-15 03:06:24.0
The first process in the SMT industry is solder paste printing. After the solder paste printing is completed, electronic components are attached to PCB pads through a SMT machine, and then reflow soldered. A preliminary PCB board is roughly processed. SMT is a combination of multiple devices, and such a line is called an SMT production line. Our common PCBA is processed through this process. In SMT technology, each process is very important, and poor quality can be caused by different process defects. Today, we are discussing the causes and countermeasures of SMT printing collapse.
Technical Library | 2023-09-16 06:29:26.0
Explore our range of reflow ovens designed to streamline your PCB assembly process. Achieve consistent and high-quality soldering for your electronic components.
Technical Library | 2023-09-15 11:42:44.0
Discover our SMT cutting machine range for precise and efficient PCB assembly. Improve production speed and quality with cutting-edge technology.
Technical Library | 2023-09-16 06:12:26.0
Discover our cost-effective wave soldering machine designed to streamline your PCB assembly process without breaking the bank. Achieve quality soldering with affordability.
Technical Library | 2023-09-16 07:04:57.0
Master the art of precision assembly with our desktop pick and place machine manual. Learn the ins and outs of efficient manual PCB assembly for enhanced productivity and quality.
Technical Library | 2023-09-16 07:16:54.0
JUKI is a leading manufacturer of SMT pick and place machines, and their products are known for their high quality, precision, and reliability. In this article, we will discuss the benefits of using JUKI PCB SMT pick and place machines, including: High accuracy and precision Fast production speeds Flexible capabilities Reliable performance
Technical Library | 2019-05-29 23:10:30.0
There are times when a PCB prototype needs to be built quickly to test out a design. In such cases where it is known early on that there will be multiple iterations or that a "one and done" assembly will be made that there will be some SMT assemblers who choose to hand print solder paste onto the board using a "frameless" stencil. In such cases where hand printing is used, the consistency of the printing technique has typically been in question. Furthermore, the effectiveness of both the nanocoatings as well as the higher end stainless steel materials, which have been heretofore studied in controlled printing environments, will be evaluated for their impact on the hand printing process.The purpose of the study was to determine the effectiveness of select nanocoating materials as well as certain high end stainless steel stencil materials as they relate to the manual SMT printing process. A variety of nanocoatings were applied to SMT metal stencils and solder paste volume measurements were taken to compare the effectiveness.
Technical Library | 2011-11-10 18:06:17.0
With the advent of larger packages and higher densities/pitch the Industry has been concerned with the coplanarity of both the substrate package and the PCB motherboard. The iNEMI PCB Coplanarity WG generated a snapshot in time of the dynamic coplanarity
Technical Library | 2014-08-19 16:04:28.0
SMT assembly planning and failure analysis of surface mount assembly defects often include component warpage evaluation. Coplanarity values of Integrated Circuit packages have traditionally been used to establish pass/fail limits. As surface mount components become smaller, with denser interconnect arrays, and processes such package-on-package assembly become prevalent, advanced methods using dual surface full-field data become critical for effective Assembly Planning, Quality Assurance, and Failure Analysis. A more complete approach than just measuring the coplanarity of the package is needed. Analyzing the gap between two surfaces that are constantly changing during the reflow thermal cycle is required, to effectively address the challenges of modern SMT assembly.
Technical Library | 2014-03-06 19:04:07.0
Over the last few years, there has been an increase in the rate of Head-in-Pillow component soldering defects which interrupts the merger of the BGA/CSP component solder spheres with the molten solder paste during reflow. The issue has occurred across a broad segment of industries including consumer, telecom and military. There are many reasons for this issue such as warpage issues of the component or board, ball co-planarity issues for BGA/CSP components and non-wetting of the component based on contamination or excessive oxidation of the component coating. The issue has been found to occur not only on lead-free soldered assemblies where the increased soldering temperatures may give rise to increase component/board warpage but also on tin-lead soldered assemblies.
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