Technical Library | 2023-08-18 03:28:47.0
Today, KINGSUN shares with you the common types and classifications of SMT mounters. 一、According to the feeding method, common ones include: 1.Tape Feeder 2.Tray Feeder 3.Tube Feeder 4.Stick Feeder 5.Special Vibration Feeder 二、According to the classification of electric and non electric, the common ones are electric feeder and mechanical feeder. Yamaha's SIGMA SMT machines are all electric feeders, while many of JUKI's feeder are mechanical feeders...... Regarding feeders related knowledge, KINGSUN share with you here , hoping to be helpful to you. More information about Products please Contact US at jenny@ksunsmt.com or visit www.ksunsmt.com . "DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD" is a leading SMT automation equipment factory provider in China. With many years of profound experience accumulation, we provides comprehensive solutions for global customers with strong resources and high-quality professional technical team.
Technical Library | 2018-05-23 12:12:43.0
Driven by miniaturization, cost reduction and tighter requirements for electrical and thermal performance, the use of lead-frame based bottom-termination components (LF-BTC) as small-outline no-leads (SON), quad-flat no leads (QFN) packages etc., is increasing. However, a major distractor for the use of such packages in high-reliability applications has been the lack of a visible solder (toe) fillet on the edge surface of the pins: because the post-package assembly singulation process typically leaves bare copper leadframe at the singulation edge, which is not protected against oxidation and thus does not easily solder-wet, a solder fillet (toe fillet) does not generally develop.
Technical Library | 2024-10-26 06:26:24.0
Copper pour is an essential design element in printed circuit boards (PCBs) that enhances thermal management, signal integrity, and electrical grounding. It involves filling unused areas on the board with copper, connecting them to power or ground planes. This feature helps manage heat dissipation, minimizes electromagnetic interference (EMI), and provides stable electrical grounding for complex circuits. While copper pour offers significant benefits, improper implementation may lead to manufacturing challenges like warping or soldering difficulties. This article explores the advantages of copper pour, the potential challenges, and how PCB Power integrates this design feature to optimize performance and durability. With advanced manufacturing processes, PCB Power ensures seamless copper pour integration for prototypes and large-scale production, offering turnkey PCB solutions for various industries.
Technical Library | 2024-11-22 06:29:45.0
This article discusses the critical importance of identifying faulty components in Printed Circuit Boards (PCBs). It outlines common signs of defective components--such as physical damage, electrical failures, and overheating--while also exploring detection techniques like visual inspection, multimeter testing, thermal imaging, and X-ray analysis. Emphasizing the significance of choosing a reliable PCB manufacturing partner, the article highlights how proactive detection can ensure greater reliability and longevity in electronic devices. For businesses seeking comprehensive PCB solutions, the article encourages engaging with specialized manufacturers to optimize their PCB projects and enhance product quality.
Technical Library | 2018-05-09 22:15:29.0
Creep corrosion on printed circuit boards (PCBs) is the corrosion of copper metallization and the spreading of the copper corrosion products across the PCB surfaces to the extent that they may electrically short circuit neighboring features on the PCB. The iNEMI technical subcommittee on creep corrosion has developed a flowers-of-sulfur (FOS) based test that is sufficiently well developed for consideration as an industry standard qualification test for creep corrosion. This paper will address the important question of how relative humidity affects creep corrosion. A creep corrosion tendency that is inversely proportional to relative humidity may allow data center administrators to eliminate creep corrosion simply by controlling the relative humidity in the data center,thus, avoiding the high cost of gas-phase filtration of gaseous contamination. The creep corrosion relative humidity dependence will be studied using a modified version of the iNEMI FOS test chamber. The design modification allows the achievement of relative humidity as low as 15% in the presence of the chlorine-releasing bleach aqueous solution. The paper will report on the dependence of creep corrosion on humidity in the 15 to 80% relative humidity range by testing ENIG (gold on electroless nickel), ImAg (immersion silver) and OSP (organic surface preservative) finished PCBs, soldered with organic acid flux.
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Nordson Electronics Solutions makes reliable electronics an everyday reality. Our ASYMTEK, MARCH, and SELECT brands deliver precision fluid dispensing, conformal coating, plasma treatment and selective soldering equipment.
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