Technical Library | 2023-01-17 17:27:13.0
Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The degree of wetting, the microstructure (in particular the intermetallic layer), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305) solder joint shear force. Specifically, the effect of the reflow peak temperature and time above solder liquidus temperature are studied. Nine reflow profiles for SAC 305 and nine reflow profiles for SnPb have been developed with three levels of peak temperature (230 o C, 240 o C, and 250 o C for SAC 305; and 195 o C, 205 o C, and 215 o C for SnPb) and three levels of time above solder liquidus temperature (30 sec., 60 sec., and 90 sec.). The shear force data of four different sizes of chip resistors (1206, 0805, 0603, and 0402) are compared across the different profiles. The shear force of the resistors is measured at time 0 (right after assembly). The fracture surfaces have been studied using a scanning electron microscopy (SEM) with energy dispersive spectroscopy (EDS)
Technical Library | 2019-08-08 10:23:51.0
High mix production is the mainstay of many electronics assembly plants. Lot sizes and board complexities vary and the boards are often mixed technology, comprising a blend of both surface mount and through-hole technology. Modularizing a production line enables a clear distinction between one type of assembly process and another. This article assumes a modern factory where a job can be routed to the selective soldering machine module, the hand assembly bench, or a combination of both. The decision rules of routing a circuit board through hand assembly versus automated selective soldering are discussed. Hand assembly soldering operations require no explanation.
Technical Library | 2023-09-18 03:06:18.0
Our SMT fully automatic printers are the perfect solution for businesses of all sizes. They are designed to be high-quality, affordable, and easy to use. Our printers are equipped with the latest features and technology to ensure accurate and consistent solder paste printing. They are also easy to set up and operate, making them a great choice for businesses that are new to SMT assembly.
Technical Library | 2010-12-22 13:59:14.0
This paper discusses polymer based nanogels, nanofluids and nanopastes for thermal interface material (TIM) applications. Nanopaste and nanogel formulated using controlled-sized particles to fill small bond lines is highlighted.
Technical Library | 2022-04-26 03:27:56.0
The naming of the chip capacitor: The parameters included in the name of the chip capacitor include the size of the chip capacitor, the material used for this chip capacitor, the required accuracy, the required voltage, the required capacity, the requirements of the terminal and packaging requirements. Generally, the parameters to be provided for ordering a chip capacitor should be the size, the required accuracy, the voltage requirement, the capacity value, and the required brand.
Technical Library | 2013-03-04 16:51:00.0
Chip-scale (or chip-size) packages are rapidly becoming an important element in electronics due to their size, performance, and cost advantages [Hou, 1998]. The Chip Scale Package (CSP) is becoming a key semiconductor package type, particularly for consumer products. Due to their relatively smaller size, new challenges are presented in the rework and repair of CSPs. (...) The specific focus of this paper is the removal process for rework of CSPs and the site scavenging methods required to properly prepare the circuit board for a new component. Process factors such as the heating, fluxing and, atmosphere are discussed.
Technical Library | 2018-09-05 21:41:30.0
In recent years, a growing number of electronic devices are being incorporated into automotive and other high reliability end products where the challenge is to make these devices more reliable. The package size of the devices is largely driven by the consumer industry with their sizes getting smaller making it harder to assemble and be reliable at the same time. For automotive and other high reliability electronics product, it is of the utmost priority to secure high reliability because it directly involves human life and safety. Challenges include selecting an appropriate solder alloy and having good reliability of the solder paste flux.
Technical Library | 2022-04-27 01:34:43.0
SMD capacitors and resistors have small sizes and many models. Some manufacturers buy a lot of products and do not use them up in time. The problem of storage is always a headache. So how should chip capacitors and resistors be stored? There are also precautions when using chip capacitors. Please see the following information and hope it will help you.
Technical Library | 2023-09-18 14:10:01.0
As with many advancements in the electronics industry, consumer electronics is driving the trends for electronic packaging technologies toward reducing size and increasing functionality. Microelectronics meeting the technology needs for higher performance, reduced power consumption and size, and off the- shelf availability. Due to the breadth of work being performed in the area of microelectronics packaging/components, this report limits it presentation to board design, manufacturing, and processing parameters on assembly reliability for leadless (e.g., quad flat no-lead (QFN) or a generic term of bottom termination component (BTC)) packages. This style of package was selected for investigation because of its significant growth, lower cost, and improved functionality, especially for use in an RF application.
Technical Library | 1999-08-09 11:36:27.0
Shrinking process technologies and increasing design sizes continually challenge design methodologies and EDA tools to develop at an ever-increasing rate. Before the complexities of deep submicron (DSM), gate and transistor delays dominated interconnect delays, and enabled simplified design methodologies that could focus on device analysis. The advent of DSM processes is changing all of this, invalidating assumptions and approximations that existing design methodologies are based upon, and forcing design teams to re-tool. High-capacity parasitic extraction tools are now critical for successful design tape-outs.
