Technical Library | 2023-09-18 03:37:30.0
Revolutionize your PCB stenciling process with our cutting-edge SMT fully automatic stencil printer. Achieve unparalleled precision and efficiency. Explore our advanced stencil printing solutions today!
Technical Library | 2024-02-02 07:48:31.0
Maximizing Efficiency: The High-Speed SMT Line With Laser Depanelizer In today's rapidly evolving electronics manufacturing landscape, optimizing efficiency, cost-effectiveness, and precision remains paramount. Businesses engaged in producing industrial control boards, computer motherboards, mobile phone motherboards, and mining machine boards face ongoing challenges in streamlining production processes. The integration of expensive equipment strains budgets, making the creation of an efficient, cost-effective high-speed SMT line a daunting task. However, a solution exists that seamlessly combines these elements into a singular, high-performance, and cost-effective SMT line. Let's delve into the specifics. A Comprehensive High-Speed SMT Line Our innovative solution amalgamates two pivotal components: a cutting-edge SMT (Surface Mount Technology) production line and a laser cutting line equipped with a depanelizer. The SMT Production Line The high-speed SMT line comprises several essential components, each fulfilling a unique role in the manufacturing process: 1. PCB Loader: This initial stage involves loading boards onto the production line with utmost care. Our Board Loader prioritizes safety, incorporating various safety light curtains and sensors to promptly halt operations and issue alerts in case of any anomalies. 2. Laser Marking Machine: Every PCB receives a unique two-dimensional code or barcode, facilitating comprehensive traceability. Despite the high-temperature laser process potentially leading to dust accumulation on PCB surfaces, our dedicated PCB Surface Cleaner swiftly addresses this issue. 3. SMT Solder Paste Printer: This stage involves applying solder paste to the boards, a fundamental step in the manufacturing process. 4. SPI (Solder Paste Inspection): Meticulous inspections are conducted at this stage. Boards passing inspection proceed through the NG (No Good) Buffer Conveyor to the module mounters. Conversely, "No Good" results prompt storage of PCBs in the NG Buffer Conveyor, capable of accommodating up to 25 PCBs. Operators can retrieve these NG boards for rework after utilizing our specialized PCB Mis Cleaner to remove solder paste. 5. Module Mounters: These machines excel in attaching small and delicate components, necessitating precision and expertise in the module mounting process. 6. Standard Pick And Place Machines: The selection of these machines is contingent upon your specific BOM (Bill of Materials) list. 7. Pre-Reflow AOI (Automated Optical Inspection): Boards undergo examination for component quality at this stage. Detected issues prompt the Sorting Conveyor to segregate boards for rework. 8. Reflow Oven: Boards undergo reflow soldering, with our Lyra series reflow ovens recommended for their outstanding features, including nitrogen capability, flux recycling, and water cooling function, ensuring impeccable soldering results. 9. Post-Reflow AOI: This stage focuses on examining soldering quality. Detected defects prompt the Sorting Conveyor to segregate boards for further inspection or rework. Any identified defects are efficiently addressed with the BGA rework station, maintaining the highest quality standards. 10. Laser Depanelizer: Boards advance to the laser depanelizer, where precision laser cutting, often employing green light for optimal results, ensures smoke-free, highly accurate separation of boards. 11. PCB Placement Machine: Cut boards are subsequently managed by the PCB Placement Machine, arranging them as required. With this, all high-speed SMT line processes are concluded. Efficiency And Output This production line demonstrates exceptional productivity when manufacturing motherboards with approximately 3000 electronic components, boasting the potential to assemble up to 180 boards within a single hour. Such efficiency not only enhances output but also ensures cost-effectiveness and precision in your manufacturing processes. At I.C.T, we specialize in crafting customized SMT production line solutions tailored to your product and specific requirements. Our equipment complies with European safety standards and holds CE certificates. For inquiries or to explore our exemplary post-sales support, do not hesitate to contact us. The I.C.T team is here to elevate your electronics manufacturing to new heights of efficiency and cost-effectiveness.
Technical Library | 2023-07-25 16:50:02.0
Some of the new handheld communication devices offer real challenges to the paste printing process. Normally, there are very small devices like 01005 chip components as well as 0.3 mm pitch uBGA along with other devices that require higher deposits of solder paste. Surface mount connectors or RF shields with coplanarity issues fall into this category. Aperture sizes for the small devices require a stencil thickness in the 50 to 75 um (2-3 mils) range for effective paste transfer whereas the RF shield and SMT connector would like at least 150 um (6 mils) paste height. Spacing is too small to use normal step stencils. This paper will explore a different type of step stencil for this application; a "Two-Print Stencil Process" step stencil. Here is a brief description of a "Two-Print Stencil Process". A 50 to 75 um (2-3 mils) stencil is used to print solder paste for the 01005, 0.3 mm pitch uBGA and other fine pitch components. While this paste is still wet a second in-line stencil printer is used to print all other components using a second thicker stencil. This second stencil has relief pockets on the contact side of the stencil any paste was printed with the first stencil. Design guidelines for minimum keep-out distances between the relief step, the fine pitch apertures, and the RF Shields apertures as well relief pocket height clearance of the paste printed by the first print stencil will be provided.
Technical Library | 2012-04-05 22:53:10.0
In this paper we show how hybrid control and modeling tech-niques can be put to work for solving a problem of industrial relevance in Surface Mount Technology (SMT) manufacturing. In particular, by closing the loop over the stencil printing process, we ob
Technical Library | 2013-11-21 12:01:11.0
Previous experimentation on a highly miniaturized and densely populated SMT assembly revealed the optimum stencil alloy and flux-repellent coating for its stencil printing process. Production implementation of the materials that were identified in the study resulted in approximately 5% print yield improvement across all assemblies throughout the operation, validating the results of the initial tests. A new set of studies was launched to focus on the materials themselves, with the purpose of optimizing their performance on the assembly line (...) Results of the prior tests are reviewed, and the new test vehicle, experimental setup and results are presented and discussed.
Technical Library | 2023-06-12 16:52:47.0
The technological advancement of component and PCB technology from through-hole to surface mount (SMT) is a major factor in the miniaturization of today's electronics. Smaller and smaller component sizes and more densely packed PCBs lead to more powerful designs in much smaller product packages. With advancement, however, comes a new set of challenges in building these smaller, more complex assemblies. This is the challenge original equipment manufacturers (OEM) and contract manufacturers (CM) face today.
Technical Library | 2021-08-04 18:46:25.0
The process of printed circuit board assembly (PCBA) involves several machines, such as a stencil printer, placement machine and reflow oven, to solder and assemble electronic components onto printed circuit boards (PCBs). In the production flow, some failure prevention mechanisms are deployed to ensure the designated quality of PCBA, including solder paste inspection (SPI), automated optical inspection (AOI) and in-circuit testing (ICT). However, such methods to locate the failures are reactive in nature, which may create waste and require additional effort to be spent re-manufacturing and inspecting the PCBs. Worse still, the process performance of the assembly process cannot be guaranteed at a high level. Therefore, there is a need to improve the performance of the PCBA process. To address the aforementioned challenges in the PCBA process, an intelligent assembly process improvement system (IAPIS) is proposed, which integrates the k-means clustering method and multi-response Taguchi method to formulate a pro-active approach to investigate and manage the process performance.
Technical Library | 2018-07-18 16:28:26.0
Reduction of first pass defects in the SMT assembly process minimizes cost, assembly time and improves reliability. These three areas, cost, delivery and reliability determine manufacturing yields and are key in maintaining a successful and profitable assembly process. It is commonly accepted that the solder paste printing process causes the highest percentage of yield challenges in the SMT assembly process. As form factor continues to get smaller, the challenge to obtain 100% yield becomes more difficult.This paper will identify defects affecting SMT yields in the printing process and discuss their Root Cause. Outer layer copper weight and surface treatment will also be addressed as to their effect on printability. Experiments using leadless and emerging components will be studied and root cause analysis will be presented
Technical Library | 2018-03-05 11:17:31.0
In order to comply with RoHS and WEEE directives, many circuit assemblers are transitioning some or all of their soldering processes from tin-lead to lead-free within the upcoming year. There are no drop-in replacement alloys for tin-lead solder, which is driving a fundamental technology change. This change is forcing manufacturers to take a closer look at everything associated with the assembly process: board and component materials, logistics and materials management, solder alloys and processing chemistries, and even soldering methods. Do not expect a dramatic change in soldering behavior when moving to lead-free solders. The melting points of the alloys are higher, but at molten temperatures the different alloys show similar behaviors in a number of respects. Expect subtler changes, especially near the edges of a process window that is assumed based on tin-lead experience rather than defined through lead-free experimentation. These small changes, many of them yet to be identified and understood, will manifest themselves with lower assembly yields. The key to keeping yields up during the transition to lead-free is quickly learning what and where the subtle distinctions are, and tuning the process to accommodate them.
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