Technical Library | 2009-10-22 02:38:13.0
An electronic product's reliability has the potential to make or break its manufacturer and can be life-threatening in many safety critical applications. Conformal coatings have long been used to protect electronic assemblies from their operating environment but can vary hugely in their protective performance. It is the objective of this article to explain in detail why it is important to qualify coating products to the relevant standards and how different coating types affect performance.
Technical Library | 2010-01-06 22:27:03.0
Increased functionality and performance requirements for microprocessors and ASICs have resulted in a trend to package these devices in the flip-chip BGA form factor (FCBGA). Because these devices use in excess of 40-100 Watts of power, their packages must dissipate heat in an extremely efficient manner. Most semiconductor companies have developed some type of thermally enhanced FCBGA package that provides heat dissipation through the back of the die to a heat spreader.
Technical Library | 2014-02-20 15:59:17.0
In this chapter, we discuss the type of parts used to create counterfeits and the defects/degradations inherent in these parts due to the nature of the sources they come from, proposed inspection standards, and limitations of these standards. The processes used to modify the packaging of these parts to create counterfeits are then discussed along with the traces left behind from each of the processes. We then present a systematic methodology for detecting signs of possible part modifications to determine the risk of a part or part lot being counterfeit.
Technical Library | 2015-08-18 17:48:53.0
Why Selectively Conformal Coat the Electronic Assembly? Printed circuit boards (PCBs) are employed in a variety of products and devices, and this means that it might be necessary for your PCBs to be moisture resistant. It is important to choose the right type of conformal coating so you need not worry about the durability of your product. Fortunately, there are several options available that can help, and you can even use selective conformal coating robots to provide proper application of the coating.
Technical Library | 2018-09-12 21:04:28.0
Counterfeit electronic components are finding their way into today’s defense electronics. The problem gets even more complex when procuring DMS (diminishing manufacturing source) parts. This paper will provide a brief introduction to counterfeit prevention and detection standards, particularly as they relate to the Aerospace and Defense sector. An analysis of industry information on the types and nature of counterfeit components will be discussed in order to illustrate those most likely to be counterfeited, followed a specific case at a major defense contractor.
Technical Library | 2019-06-03 21:07:34.0
The objective of this White Paper is to provide users of the above products in the electronics industry a clear understanding of the different types of stencil cleaning paper/fabrics that are currently available. Fine pitch applications are more the norm now and so the performance of stencil cleaning rolls is more critical than ever before. This White Paper will give solder paste stencil printing engineers and purchasing professionals an insight into the main products on the market, thereby enabling them to make informed decisions.
Technical Library | 2020-01-22 22:52:02.0
Flip chip assembly techniques bring a wide range of benefits: Reduced parasitic interconnection between the semiconductor die and package. Provides a high final assembly integrity density. Minimize the interconnection length, providing better electrical performances, especially for high speed signals. Reduce the device size and weight,…, etc. But there is no dedicated inspection requirements nor DPA standard which address all the necessary aspects associated to this construction type or only cover partially the topics to be inspected.
Technical Library | 2020-06-10 01:42:55.0
Recent advancement of flexible wearable electronics allows significant enhancement of portable, continuous health monitoring and persistent human-machine interfaces. Enabled by flexible electronic systems, smart and connected bioelectronics are accelerating the integration of innovative information science and engineering strategies, ultimately driving the rapid transformation of healthcare and medicine. Recent progress in the development and engineering of soft materials has provided various opportunities to design different types of mechanically deformable systems towards smart and connected bioelectronics.
Technical Library | 2021-04-01 14:36:51.0
This document provides information about the Surface Mount Technology (SMT) board assembly of Infineon Thin Small Non-leaded Packages (TSNP). The specific dimensions of the leadframe based inner setup depend on the size of the chip and the type of bonding. The field of application ranges from linear voltage regulators for weight-limited applications such as cellular phones and digital cameras to linear voltage regulators for the automotive sector.
Technical Library | 2021-04-15 14:39:41.0
Inspection of printed circuit board (PCB) has been a crucial process in the electronic manufacturing industry to guarantee product quality & reliability, cut manufacturing cost and to increase production. The PCB inspection involves detection of defects in the PCB and classification of those defects in order to identify the roots of defects. In this paper, all 14 types of defects are detected and are classified in all possible classes ...
