Technical Library: vietnam circuit board assembly (Page 3 of 13)

What Your Electronic Manufacturing Service Provider Needs from You

Technical Library | 2007-03-13 14:28:27.0

This article tells what your electronic manufacturing service providers needs from you to prepare an accurate quotation for a typical printed circuit board assembly project.

Innovative Circuits Inc.

Characteristics of Conformal Coatings

Technical Library | 2007-08-28 20:18:06.0

A conformal coating is defined as a thin polymeric material which covers the surface of an electronic assembly. These coatings are used to provide an electrically insulative and environmentally protective seal or cover to a completed printed circuit board (PCB).

Electronics Manufacturing Productivity Facility (EMPF)

Design Guidelines For In-Circuit Testability

Technical Library | 2021-03-24 01:26:05.0

In-circuit test (ICT) has remained one of the most popular and cost-effective test methods for medium and high volume printed circuit board assembly (PCBA) for many years. This is due to its component-level fault diagnosis capability- and its speed.

JJS Manufacturing

Avoidance of Ceramic-Substrate-Based LED Chip Cracking Induced by PCB Bending or Flexing

Technical Library | 2022-09-25 20:18:33.0

Printed circuit board (PCB) bending and/or flexing is an unavoidable phenomenon that is known to exist and is easily encountered during electronic board assembly processes. PCB bending and/or flexing is the fundamental source of tensile stress induced on the electronic components on the board assembly. For more brittle components, like ceramic-based electronic components, micro-cracks can be induced, which can eventually lead to a fatal failure of the components. For this reason, many standards organizations throughout the world specify the methods under which electronic board assemblies must be tested to ensure their robustness, sometimes as a pre-condition to more rigorous environmental tests such as thermal cycling or thermal shock.

Cree Lighting

Success Story of PCB Assembly Trend

Technical Library | 2016-08-04 10:34:35.0

With the onset of 1900’s, the novelty of printed circuits boards got started with a profound concept of constructing an electrical path on an isolated surface of a board. The initial trend of printed circuit board got into a vain to develop and upgrade the radios and gramophones. Gradually the notion of ‘Through Hole Technique’ came into picture to produce a double sided PCB. In mid 1990’s the idea of auto assembly process was introduced by PCB Manufacturer USA. This was a point of modern touch to enhance the fabrication process with automated soldering technique. The research and development picked up a pace for end to end electronic solutions for defense and US army.

4PCB Assembly

DOE for Process Validation Involving Numerous Assembly Materials and Test Methods.

Technical Library | 2010-03-18 14:02:03.0

Selecting products that have been qualified by industry standards for use in printed circuit board assembly processes is an accepted best practice. That products which have been qualified, when used in combinations not specifically qualified, may have resultant properties detrimental to assembly function though, is often not adequately understood. Printed circuit boards, solder masks, soldering materials (flux, paste, cored wire, rework flux, paste flux, etc.), adhesives, and inks, when qualified per industry standards, are qualified using very specific test methods which may not adequately mimic the assembly process ultimately used.

Trace Laboratories

Process Development And Characterization Of The Stencil Printing Process For Small Apertures

Technical Library | 2008-01-16 18:25:55.0

The consumer's interest for smaller, lighter and higher performance electronics products has increased the use of ultra fine pitch packages, such as Flip Chips and Chip Scale Packages, in printed circuit board (PCB) assembly. The assembly processes for these ultra fine pitch packages are extremely complex and each step in the assembly process influences the assembly yield and reliability.

Speedline Technologies, Inc.

Printed Circuit Board Technology Inspired Stretchable Circuits

Technical Library | 2013-10-10 16:28:21.0

In the past 15 years, stretchable electronic circuits have emerged as a new technology in the domain of assembly, interconnections, and sensor circuit technologies. In the meantime, a wide variety of processes using many different materials have been explored in this new field. In the current contribution, we present an approach inspired by conventional rigid and flexible printed circuit board (PCB) technology.

Centre for Microsystems Technology - Ghent University

Controlling Moisture in Printed Circuit Boards

Technical Library | 2019-05-01 23:18:27.0

Moisture can accelerate various failure mechanisms in printed circuit board assemblies. Moisture can be initially present in the epoxy glass prepreg, absorbed during the wet processes in printed circuit board manufacturing, or diffuse into the printed circuit board during storage. Moisture can reside in the resin, resin/glass interfaces, and micro-cracks or voids due to defects. Higher reflow temperatures associated with lead-free processing increase the vapor pressure, which can lead to higher amounts of moisture uptake compared to eutectic tin-lead reflow processes. In addition to cohesive or adhesive failures within the printed circuit board that lead to cracking and delamination, moisture can also lead to the creation of low impedance paths due to metal migration, interfacial degradation resulting in conductive filament formation, and changes in dimensional stability. Studies have shown that moisture can also reduce the glass-transition temperature and increase the dielectric constant, leading to a reduction in circuit switching speeds and an increase in propagation delay times. This paper provides an overview of printed circuit board fabrication, followed by a brief discussion of moisture diffusion processes, governing models, and dependent variables. We then present guidelines for printed circuit board handling and storage during various stages of production and fabrication so as to mitigate moisture-induced failures.

CALCE Center for Advanced Life Cycle Engineering

Alternatives to HASL: Users Guide for Surface Finishes

Technical Library | 1999-08-09 11:11:55.0

A great deal of controversy continues to surround the use of Hot Air Solder Leveling (HASL) in the production of printed circuit boards (PCBs). The financial burden, technological limitations and environmental issues surrounding the HASL process continue to grow. This requires an in-depth review by the printed circuit board manufacturing plant, as well as the assembly operation and instrument designers ( OEMs), to determine what alternative surface finishes are appropriate.

Viasystems Group, Inc.


vietnam circuit board assembly searches for Companies, Equipment, Machines, Suppliers & Information

Midwest Circuit Technology
Midwest Circuit Technology

Midwest Circuit Technology provides Carbide Router Bits and End Milling Cuters for use in PCB Depaneling equipment. We have over 35 years of supplying tools and machining experience in drilling, Routing, Test Fixture manufacture.

Manufacturer / Distributor

114 Barrington Town Square
Aurora, OH USA

Phone: 13309956900