Used SMT Equipment | Adhesive Dispensers
YAMAHA placement machine YV100X type substrate size: 1, M-Type: L460 * W335 ~ L50xW50mm / t = 0.4 ~ 3.0mm 2, L-Type: L460 * W440 ~ L50xW50mm / t = 0.4 ~ 3.0mm 3, ※ATS20A use: L460*W250～L50xW50mm Second, YAMAHA placement machine YV100X productio
Used SMT Equipment | Adhesive Dispensers
Asymtek M620 Underfill Dispenser DP3000 head Inline heater system Digital Scale Vision system with camera Flat screen monitor
Used SMT Equipment | Adhesive Dispensers
Speedline Camalot 3800 Dispenser Vintage: 2001 Max Dispense Area: 14" x 14" Dual Dispense Pump Pass Thru Conveyor System Vision System for Programming Fiducial Correction Power: 120V Jake@lelsemi.com
Used SMT Equipment | Adhesive Dispensers
Camalot3600 Automatic Dispense System and Underfill System in Like New Condition
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Used SMT Equipment | Adhesive Dispensers
Asymtek Dispensemate 555 Dispensing System The DispenseMate 550 Series brings new dispensing power to a compact package. In a benchtop format, many of today's advanced automated dispensing features are available. It is ideal for batch processing or
Used SMT Equipment | Adhesive Dispensers
Camelot 3600 Glue Dispenser Year (or range of years): 2000 Condition: Very Good Has 635-Positive Displacement pump Preheat and Post-Dispense heating Weigh scaleglass overlay(placement head in it) VMS-volume metric measurement system
Used SMT Equipment | Adhesive Dispensers
2010 Asymtek Model 585 Dispenser Work envelope = 525 x 525 mm. The DispenseMate® platform provides similar dispense control technology as Nordson ASYMTEK’s most advanced dispensing systems, including closed-loop DC servo motion control, Jet-on-the-F
Used SMT Equipment | Adhesive Dispensers
Camalot 5000 Dispense System; 665 Dual Height Positive Displace Pump; SN: 5000-2179; CE
Used SMT Equipment | Adhesive Dispensers
Camalot 1818 dispenser Through-Hole and Surface Mount Assembly: 18" x 18" Work Area In-line Dispenser with PDP 665-1 positive displacement pump and vision. Configurable for most surface mount assembly and semiconductor packaging
