Used SMT Equipment | Pick and Place/Feeders
Product name: KE - 2070 JUKI high-speed chipmounter Product number: KE - 2070 Products in detail Features: Suitable for high speed SMT chip placementmachine of small components. Not only the element corresponding to a wide rangeof laser recogniti
Used SMT Equipment | SMT Equipment
Product name: KE - 2070 high-speed chip mounter Product number: KE - 2070 Products in detail Features: Suitable for high speed SMT chip placement machine of small components. Not only the element corresponding to a wide range of laser recogniti
Used SMT Equipment | SMT Equipment
Product name: KE - 2080 high-speed chip mounter Product number: KE - 2080 Detailed product introduction Characteristic： Small components of high speed SMT capacity and IC or complex shape abnormity components of high precision SMT ability and g
Used SMT Equipment | SMT Equipment
Product name: KE - 2070 high-speed chip mounter Product number: KE - 2070 Products in detail Features: Suitable for high speed SMT chip placement machine of small components. Not only the element corresponding to a wide range of laser recogniti
Used SMT Equipment | SMT Equipment
Product name: KE - 2080 high-speed chip mounter Product number: KE - 2080 Detailed product introduction Characteristic： Small components of high speed SMT capacity and IC or complex shape abnormity components of high precision SMT ability and g
Used SMT Equipment | Chipshooters / Chip Mounters
The NXTR A model includes an automatic feeder exchange system that frees operators from changeover and supply work, with additional features that strengthen the ability to maintain high-quality and productivity. Fuji is paving the way to the future o
Used SMT Equipment | Pick and Place/Feeders
FEATURES ▶Higher productivity and quality with printing, placement and inspection process integration▶For larger boards and larger PCBs up to a size of 750 x 550 mm with component range up to L150 x W25 x T30 mm▶Higher area productivity through dual
Used SMT Equipment | Pick and Place/Feeders
Board size (without buffer function) minimum L50 x W30mm～maximum L1,480 x W510mm Substrate size (when using inlet and outlet buffer functions) Minimum L50 x W30mm～Maximum L540 x W510mm Substrate thickness 0.4~4.8mm Board conveying direction: left&
Used SMT Equipment | Pick and Place/Feeders
Board size L50 x W50mm to L460 (Max. L1200 OP) x W410mm Board thickness 0.5 to 2.0mm &nb
Used SMT Equipment | Pick and Place/Feeders
Board size L50xW50mm – L460 xW410mm Board thickness 0.5mm-2.0mm Flow direction Left to right Conveyor speed Max. 420mm/sec, speed variable, soft stop fuction Placement speed A (NB1) 0.13 sec/CHIP, 0.38 sec/TSOP32 Placement speed B
