Industry News | 2003-04-29 08:27:33.0
Emerson Energy Systems is using Weidmuller's Minimate S2L/B2L PCB connector for its IMT 2000 multifunction unit, thanks to its space saving design and competitive price.
Industry News | 2003-04-14 08:50:52.0
Providing connection facilities for PCBs designed to be used in hazardous areas is straightforward with Phoenix Contact's new range of Combicon Ex-approved printed circuit terminal blocks.
Industry News | 2003-06-04 09:19:23.0
With increasing demand for fine pitch placements and a growing amount of fast turnaround high-tech low-volume prototype work, Speedboard has invested in additional SMT/BGA placement/rework equipment.
Industry News | 2003-05-19 08:44:19.0
Two new PCB power connectors offer easy high power wiring (up to 54A) with built-in safety features to prevent incorrect connections and resist strong vibration.
Industry News | 2014-06-22 19:12:37.0
MIRTEC, “The Global Leader in Inspection Technology,” will exhibit in Booth #5444-1 at SEMICON West 2014, scheduled to take place July 8-10 at the Moscone Center in San Francisco, CA.
Industry News | 2008-03-25 23:53:54.0
Comment from Brian D�Amico, President
Industry News | 2010-04-30 18:47:15.0
SMTA China announces that it presented awards for the 10 best papers/presentations and two best exhibits at the SMTA China East 2010 Conference Award Presentation Ceremony, held on Wednesday, April 21, 2010 at the Shanghai Everbright International Hotel in conjunction with the SMTA China Annual Breakfast Reception.
Industry News | 2023-03-22 09:50:04.0
Precision PCB Services, Inc. will Demo the Zhuomao ZM-R7220A BGA Rework Station at SMTA Expo, Dallas on March 28th.
Industry News | 2016-06-19 19:44:55.0
The SMTA and Chip Scale Review magazine are pleased to announce the Keynote Presenters for the 13th Annual International Wafer-Level Packaging Conference. The IWLPC will be held October 18-20, 2016 at the DoubleTree Airport Hotel in San Jose, California.
Industry News | 2013-01-30 17:54:43.0
Design, assembly, inspection and repair personnel have a new tool to help improve reliability of ball grid arrays (BGAs) and fine-pitch ball grid arrays (FBGAs) in high density applications, thanks to the newly released C revision of IPC-7095, Design and Assembly Process Implementation for BGAs.
