Industry News: 0.4 mm solder ball size after reflow (Page 1 of 3)

MIRTEC TO EXHIBIT A NEW INSPECTION SYSTEM WITH THE PERFECT INSPECTION SOLUTION AT NEPCON CHINA 2017

Industry News | 2017-04-24 19:04:48.0

This year, MIRTEC will launch several new inspection machines equipped new cutting-edge technologies. MIRTEC is proud to be promoting these new machines in booth #1J10 at NEPCON China 2017, one of the biggest technical exhibitions of SMT and EMA, from April 25-27 at the Shanghai World EXPO Exhibition & Convention Center. MIRTEC’s new machines have been developed under a concept, ‘Perfect Inspection Solution’. This is an inspection concept involving the combination of 3D, 2D, and side-camera inspection.

MIRTEC Corp

Manncorp's 6,400 CPH dual-head MC-392 pick-and-place features ball screw X-Y and 30um, 3 sigma accuracy

Industry News | 2010-12-01 13:36:54.0

Although all five models in Manncorp’s latest-generation MC series pick-and-place systems have received industry acclaim, one system in particular has stood out for its extraordinary price/performance ratio, according to CEO Henry Mann.

Manncorp

PNC Inc.’s BGA Assembly

Industry News | 2017-03-23 11:33:40.0

Outline of PNC Inc's BGA assembly capabilities.

PNC Inc.

Ball Grid Array (BGA) Package

Industry News | 2018-12-08 03:31:22.0

Ball Grid Array (BGA) Package

Flason Electronic Co.,limited

Practical Components to Display Its Latest Products at the IPC APEX EXPO

Industry News | 2013-02-04 14:14:48.0

Practical Components and its sister company Practical Tools will exhibit in booth A16 at the upcoming IPC APEX Expo

Practical Components, Inc.

Amkor ULTRA CSP� Test Die

Industry News | 2002-09-17 15:09:18.0

Practical Dummy Components

Practical Components, Inc.

An Analysis of SMT Solder Paste Printing Defects

Industry News | 2018-10-18 08:27:03.0

An Analysis of SMT Solder Paste Printing Defects

Flason Electronic Co.,limited

Ersa to Demo High-Performance Wave Solder Automation Line at APEX

Industry News | 2020-01-07 11:01:33.0

Kurtz Ersa Inc. today announced plans to exhibit at the 2020 IPC APEX EXPO, scheduled to take place Feb. 4-6, 2020 at the San Diego Convention Center in California. Company representatives will showcase Ersa‘s wave soldering, reflow soldering, selective soldering, rework equipment, I4.0 connectivity and more in Booth #844.

kurtz ersa Corporation

PRINCIPLE OF SURFACE MOUNT PROCESS(SMT PROCESS)

Industry News | 2018-10-18 08:59:34.0

PRINCIPLE OF SURFACE MOUNT PROCESS(SMT PROCESS)

Flason Electronic Co.,limited

Raw Material Choices for PCBs

Industry News | 2018-10-18 11:10:33.0

Raw Material Choices for PCBs

Flason Electronic Co.,limited

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