Industry News | 2003-04-15 08:39:15.0
Granted supplier qualification by the United States Department of Defense's Defense Supply Center Columbus (DSCC)
Industry News | 2003-03-25 09:15:19.0
The Dragon was demonstrated at the CPCA show in Shanghai last week
Industry News | 2018-05-01 19:25:27.0
Mil-aero and automotive engineers who want to increase their knowledge of electronics subjected to harsh use environments should attend IPC’s High Reliability Forum in Linthicum (Baltimore), Md., May 15-17, 2018.
Industry News | 2018-09-23 09:57:15.0
Industry-leading associations IPC and SMTA jointly announce the High-Reliability Cleaning and Conformal Coating Conference, scheduled to take place November 13-15, 2018 at Chicago Marriott, Schaumburg, Illinois. The conference is focused on the cleanliness of highly dense electronic assemblies to achieve quality and reliability within the stated in-field environment.
Industry News | 2017-05-15 15:41:33.0
IPC's Validation Services Program has awarded an IPC-4101 Qualified Products Listing (QPL) to Taiwan Union Technology Corporation (TUC), an electronics materials manufacturing company headquartered in Jhubei, Hsinchu County, Taiwan. TUC provides mass lamination services, copper clad laminates and prepregs to the global electronics industry. To earn the QPL, TUC successfully completed an intensive audit based on IPC's foremost standard on base materials for laminates and prepregs: IPC 4101, Specification for Base Materials for Rigid and Multilayer Printed Boards.
Industry News | 2013-07-22 10:52:48.0
Count On Tools (COT) Inc announces that it has developed an improved process for marking its Fuji NXT products.
Industry News | 2022-08-29 15:06:06.0
SMTA members and staff were among the 50 carefully-selected invitees who participated in the Future Electronics Workforce (F.E.W.) Summit held at Michigan Technological University (MTU) on August 17, 2022. Co-sponsored by Calumet Electronics and Michigan Technological University, and supported by the US Department of Defense (DoD) Industrial Base Analysis and Sustainment (IBAS) program, the summit had the goal of generating and implementing specific actions for each of the major stakeholder groups present that could ease the potentially crippling shortage of replacement technical staff in defense-critical electronics manufacturing.
Industry News | 2012-08-03 08:30:27.0
Omron Inspection Systems (www.omron247.com) will display and demo its latest concepts and enhancements in AOI systems at the 2012 IPC Midwest Conference & Exhibition
Industry News | 2019-05-12 15:58:00.0
Fast Shipment of Custom SRT Nozzles
Industry News | 2019-11-05 22:19:03.0
> News-Blog > Guideline for wire bonding Guideline for wire bonding Tuesday,Jun 12,2018 There are two wire bonding processes that are used, Thermosonic (T/S) Gold Ball Wire Bonding and Ultrasonic (U/S) Aluminum Wedge Wire Bonding. Approximately 90% of all IC Assembly in Semiconductor Packages is manufactured using Gold Ball Bonding process, while Aluminum Wedge Bonding is used to produce about 10% of other Wire Bonding requirements on Printed Circuit Boards (PCB), Printed Circuit Flex (PCF) and other Packages.
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