Industry News: assembly cost (Page 3 of 404)

University Pioneers Assembly Technolology

Industry News | 2003-03-28 08:24:43.0

The manufacture of electronic devices could be revolutionised thanks to assembly research being pioneered at the University of Greenwich.

SMTnet

Tessera Introduces PYXIS� Packaging Technology - World's First Chip-Scale Packaging Solution for Highly Integrated RF Modules

Industry News | 2003-04-15 08:57:18.0

First Implementation of the Package Platform Delivers 50-percent Cost, 60-percent Height, and 75-percent Area Reductions over Conventional RF Module Technologies

SMTnet

Ease of Application for Infiniband I/O Connectors

Industry News | 2003-04-22 09:33:13.0

Honda Connectors has released its first Infiniband I/O connectors, designed for easy assembly in high-speed differential signal applications.

SMTnet

New EMS, Lightspeed Manufacturing, Opens for Business

Industry News | 2003-03-11 08:16:17.0

Lightspeed has already shipped its first product, and has set up production in a new building with up to date facilities and equipment.

SMTnet

Altium CAM System and Free ODB++ Viewer Bridge Gap Between PCB Design and Manufacture

Industry News | 2003-03-11 08:45:00.0

CAMtastic DXP is the latest version of Altium's complete CAM verification and editing system that bridges the gap between PCB design and manufacturing and facilitates communication between board designers, fabrication engineers, and their clients.

SMTnet

RSI's eSight Design for Manufacturability Solution Lowers PCB Manufacturing and Implementation Costs

Industry News | 2003-02-13 08:11:45.0

eSight Can Reduce Time-to-manufacture and Time-to-market by as Much as 80%

SMTnet

GPS Antenna Shrinks to Surface Mounting

Industry News | 2003-03-14 09:03:48.0

Sarantel has developed a surface-mount version of its active GeoHelix miniature GPS antenna.

SMTnet

MIRTEC RECEIVES TWO PRESTIGIOUS AWARDS AT APEX 2016

Industry News | 2016-03-18 10:45:49.0

MIRTEC, “The Global Leader in Inspection Technology,” announces that it received two awards at the 2016 IPC APEX EXPO. MIRTEC’s MV-6 OMNI 3D AOI system was recognized with a 2016 New Product Introduction (NPI) Award in the category of Test & Inspection – AOI. Additionally, MIRTEC received the prestigious 2016 Service Excellence Award (SEA) from Circuits Assembly magazine in the Test and Inspection category. Mike Buetow, Circuits Assembly’s Editor-in-Chief, presented the awards to Brian D’Amico, President of MIRTEC’s North American Sales and Service Division during a Tuesday, March 15, 2016 ceremony that took place at the Las Vegas Convention Center.

MIRTEC Corp

CirTran Receives Order From U.S. Government Agency

Industry News | 2003-02-27 08:13:16.0

The order was placed through CirTran's wholly owned subsidiary, Racore Technology Corporation.

SMTnet

SMT Hautes Technologies Selects MIRTEC for Leading-Edge 3D AOI Technology

Industry News | 2016-11-14 20:04:34.0

MIRTEC, “The Global Leader in Inspection Technology,” is pleased to announce that SMT Hautes Technologies, has selected MIRTEC’s award winning MV-7 OMNI as their future 3D AOI platform of choice.

MIRTEC Corp


assembly cost searches for Companies, Equipment, Machines, Suppliers & Information

Golden State Assembly
Golden State Assembly

Golden State is a contract manufacturer that makes wire harnesses, electromechanical assemblies (box builds, subassemblies, PCBAs, kits, etc.) and services (sorting, rework, value additive manufacturing engineering)

Manufacturer

18220 Butterfield Blvd
Morgan Hill, CA USA

Phone: 5102268155