Industry News: bakeout (Page 1 of 1)

Indium Corporation to Feature High-Reliability Materials for Power Electronics at NEPCON Japan

Industry News | 2024-01-29 11:33:44.0

Indium Corporation® is proud to showcase its proven advanced assembly materials for power electronics, including the rapidly evolving electric vehicle (EV) manufacturing and e-Mobility market, at NEPCON Japan, January 24-26, in Tokyo, Japan. Indium Corporation's products for power electronics have been demonstrated to reduce energy consumption and solve warpage issues for its customers while ensuring high reliability and improving overall efficiency.

Indium Corporation

Indium Corporation to Feature Precision Au-Based Die-Attach Preforms at SPIE Photonics West

Industry News | 2024-01-29 11:36:51.0

Indium Corporation® will feature its high-reliability, Au-based precision die-attach (PDA) preforms for critical laser and RF applications at SPIE Photonics West, Jan. 27-Feb. 1, in San Francisco. SPIE West is the world's premier event for lasers, biomedical optics and biophotonic technologies, quantum, and optoelectronics.

Indium Corporation

Indium Corporation to Showcase High-Reliability Materials for Power Electronics at APEC

Industry News | 2024-02-19 12:00:05.0

Indium Corporation® will feature selections from its portfolio of proven products for automotive and power electronics applications, including electric vehicle manufacturing, at APEC 2024, February 25‒29 in Long Beach, California.

Indium Corporation

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