Industry News | 2021-10-11 08:08:21.0
Koh Young, the industry leader in True3D™ measurement-based inspection solutions, announces the release of its new Meister D+ semiconductor inspection solution. Premium True3D™ Inspection Solution for Chiplets and System-in-Package (SiP) devices including die and surface mount components. The new Meister D+ is an extension of the Meister product family that features solutions ranging from solder paste, printed bumps, and solder ball to small components like 0201Ms and highly reflective die.
Industry News | 2015-10-22 16:43:19.0
SHENMAO SMF-WB02 / SMF-WB51 Water Soluble Flux are made locally in the USA and with the same quality in 7 other worldwide locations. It is said their Low Viscosity (easy to apply), High Tackiness (slump resistant), consistent printability for BGA and Micro BGA Ball Assemblies and excellent wash ability after high temperature reflow (255ºC and 60 sec over 220ºC) create highly reliable Solder Joints with optimum maximized Quality.
Industry News | 2016-05-24 20:29:22.0
SHENMAO SMF-WB02 / SMF-WB51 Water Soluble Flux are made locally in the USA and with the same quality in 7 other worldwide locations. It is said their Low Viscosity (easy to apply), High Tackiness (slump resistant), consistent printability for BGA and Micro BGA Ball Assemblies and excellent wash ability after high temperature reflow (255ºC and 60 sec over 220ºC) create highly reliable Solder Joints with optimum maximized Quality.
Industry News | 2016-07-11 20:50:22.0
SHENMAO SMF-WB02 / SMF-WB51 Water Soluble Flux are made locally in the USA and with the same quality in 9 other worldwide locations. It is said their Low Viscosity (easy to apply), High Tackiness (slump resistant), consistent printability for BGA and Micro BGA Ball Assemblies and excellent wash ability after high temperature reflow (255ºC and 60 sec over 220ºC) create highly reliable Solder Joints with optimum maximized Quality.
Industry News | 2010-09-16 21:44:04.0
The Balver Zinn Group announces that Cobar Europe BV now distributes Yincae Advanced Materials’ SMT 158 Capillary Underfill and SMT 256 Individual Solder Joint Encapsulations throughout Europe.
Industry News | 2017-06-25 20:33:39.0
SHENMAO Technology, Inc. introduces New Generation Ultra Tacky Flux SMF-WC52 applied in the Flip Chip dipping process. Its high tacky property keeps Chip in place during reflow for excellent soldering performance, while creating outstanding solder joint strength.
Industry News | 2010-07-29 14:45:16.0
Henkel’s non-conductive paste (NCP) solutions have long enjoyed a leading market position for traditional Gold – Gold flip chip processes. Recent NCP innovations from the global materials leader are also now enabling next-generation, high I/O fine-pitch technologies including new copper pillar (Cu Pillar) interconnects.
Industry News | 2021-06-02 05:34:04.0
EasySpheres is the exclusive worldwide provider of high quality, first run solder balls at reasonable quantities and excellent prices. The company is a leading provider and technical guide to many of the solder attach and bumping challenges that customers face today.
Industry News | 2022-08-14 14:16:58.0
Test Research, Inc. (TRI) will join SEMICON Taiwan held at Taipei Nangang Exhibition Center, Hall 1 – 4F from September 14 - 16, 2022. Visit booth #M1034 to experience the latest in Smart Factory Semiconductor Inspection.
