Industry News: best oven profile for voids (Page 1 of 4)

New Technology for Void-free Reflow Soldering

Industry News | 2018-10-18 09:16:42.0

New Technology for Void-free Reflow Soldering

Flason Electronic Co.,limited

How to get real-time thermal data for a PCB?

Industry News | 2018-10-18 10:20:21.0

How to get real-time thermal data for a PCB?

Flason Electronic Co.,limited

Printed Circuit Board (PCB) for Surface Mount Technology (SMT)

Industry News | 2018-12-08 03:27:35.0

Printed Circuit Board (PCB) for Surface Mount Technology (SMT)

Flason Electronic Co.,limited

BTU to Show Vacuum Reflow Oven for Superior Profile Control at SEMICON China

Industry News | 2021-02-23 15:00:48.0

BTU International, Inc. today announced plans to exhibit at SEMICON China, scheduled to take place March 17-19, 2021 at the Shanghai New International Expo Centre. The PYRAMAX™ Vacuum Reflow Oven will be displayed in the CohPros booth, Hall E7 #7343.

BTU International

BTU Accepts 5th Award for Vacuum Reflow Oven

Industry News | 2021-11-17 15:16:38.0

BTU International, Inc. is pleased to announce that it received a 2021 GLOBAL Technology Award in the category of Reflow Ovens for its PYRAMAX™ Vacuum Reflow Oven. The award was announced during a ceremony that took place Tuesday, Nov. 16, 2021 during productronica in Munich, Germany. This is the fifth industry award that BTU has received for the PYRAMAX Vacuum.

BTU International

X Marks the Spot for Solderstar's New Datalogger at SMTconnect

Industry News | 2022-03-25 12:39:22.0

Since launching at the end of last year, Solderstar's innovative new thermal profiler 'SLX' has gone from strength to strength thanks to its innovative new additions which will be showcased during SMTconnect Nuremberg from 10-12 May 2022 Hall 4 Stand 226.

Solderstar

X Marks the Spot for Solderstar's New Datalogger at SMTconnect

Industry News | 2022-03-25 12:40:21.0

Since launching at the end of last year, Solderstar's innovative new thermal profiler 'SLX' has gone from strength to strength thanks to its innovative new additions which will be showcased during SMTconnect Nuremberg from 10-12 May 2022 Hall 4 Stand 226.

Solderstar

X Marks the Spot for Solderstar's New Datalogger at SMTconnect

Industry News | 2022-03-25 12:40:48.0

Since launching at the end of last year, Solderstar's innovative new thermal profiler 'SLX' has gone from strength to strength thanks to its innovative new additions which will be showcased during SMTconnect Nuremberg from 10-12 May 2022 Hall 4 Stand 226.

Solderstar

SHENMAO's New Room Temperature Solder Paste Offers Stability for a Range of Temperature Conditions

Industry News | 2020-05-30 12:34:54.0

SHENMAO America, Inc. is pleased to introduce its new PF606-RT35 room temperature solder paste (RTS) that has been specially designed for SMT processes. Compared with common pastes, the no-clean paste provides consistent printing performance, low voiding, stable viscosity life, and excellent testability. With the wide reflow window, it even can be easily fit into the process of the most complicated PCB design.

Shenmao Technology Inc.

KIC Receives Global Technology Award for Its SPS Smart Profiler

Industry News | 2017-11-15 17:25:25.0

KIC announces that it was awarded a 2017 Global Technology Award in the category of Assembly Tools for its SPS Smart Profiler. The award was presented to the company during a Tuesday, Nov. 14, 2017 ceremony that took place during productronica in Munich, Germany. The SPS utilizes smart factory technologies to acquire and analyze thermal process for new insight and actionable data leading to increased production line utilization, reduced rework and electricity use.

KIC Thermal

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