Industry News: bga and delamination (Page 17 of 24)

STI Electronics to Feature Engineering Services and Training Resources at the 2011 Pan Pacific Microelectronics Symposium

Industry News | 2010-12-23 01:23:35.0

STI Electronics, Inc. will highlight its key engineering services and training resources at the upcoming Pan Pacific Microelectronics Symposium & Tabletop Exhibition, scheduled to take place January 18-20, 2011 at the Hapuna Beach Prince Hotel on the Big Island of Hawaii.

STI Electronics

Essemtec to Highlight EXPERT-SAFP with BGA Placer at SMTA Long Island Expo and Technical Forum 2011

Industry News | 2011-09-01 22:08:39.0

Essemtec will exhibit Swiss Made, highly flexible SMD placement systems for prototyping and low volumes at the upcoming SMTA Long Island Expo and Technical Forum.

ESSEMTEC AG

OK International to Host Series of Advanced Package Rework and Repair Seminars

Industry News | 2012-02-23 15:25:06.0

OK International announced the schedule for its Advanced Package Rework and Repair seminars in 2012. The seminars will address the latest techniques to rework and repair BGAs, QFNs and micro SMDs.

OK International

Invensas Targets Ultrabooks and Tablet Applications with DIMM-IN-A-PACKAGE Solution Based on xFD Technology

Industry News | 2012-04-11 15:15:57.0

Invensas Will Demo xFD Solutions at IDF Beijing and Present at the International Conference on Electronics Packaging in Tokyo

Invensas Corporation

Viscom Strengthens Its Manual and Semiautomatic Inspection for the Electronics Industry

Industry News | 2012-07-26 11:02:01.0

Viscom AG, Hanover, has strengthened its activities in the areas of manual and semiautomatic X-ray inspection and intensified the technical development of X-ray inspection for the electronics industry.

Martel Marketing Communications, Inc.

KIC Introduces ProBot – The Profiling Robot That Perfects Your AOI and Batch X-Ray Inspection

Industry News | 2012-09-28 07:02:31.0

KIC today announced that the new ProBot will begin shipping effective October 2012.

KIC Thermal

STI Electronics, Inc. to Discuss Training and Engineering Capabilities at the IPC APEX EXPO

Industry News | 2013-01-14 11:12:13.0

STI Electronics, Inc. will exhibit in Booth #1605 at the upcoming IPC APEX EXPO, scheduled to take place February 19-21, 2013 at the San Diego Convention Center in California. STI Electronics will highlight all aspects of the company, including Engineering Services, Training Resources and Manufacturing Assembly Supplies.

STI Electronics

Viscom to showcase advanced 3D Inspection solutions and new TrueYield concept for line performance optimization

Industry News | 2015-03-17 11:57:01.0

At the upcoming 2015 Nepcon Shanghai show Viscom AG, leading manufacturer of highly precise and efficient inspection systems for the electronics industry, will showcase its latest innovations, demonstrating the highlights of its most advanced and comprehensive range of 3D- AOI, SPI and X-ray inspection systems.

Viscom AG

STI Electronics to Discuss Engineering Services and Training Resources at SMTA Atlanta

Industry News | 2015-04-06 12:14:25.0

STI Electronics will exhibit at the SMTA Atlanta Expo & Tech Forum, scheduled to take place Wednesday, April 15, 2015 at the Gwinnett Center in Duluth, GA. Company representatives will discuss STI’s Engineering Services and Training Resources divisions.

STI Electronics

Scienscope Will Discuss Its X-ray and Microscope Capabilities at MD&M East

Industry News | 2015-05-07 19:39:56.0

Scienscope International will exhibit in Booth #2421 at MD&M East, scheduled to take place June 9-11, 2015 at the Jacob K. Javits Convention Center in New York, NY. Company representatives will discuss Scienscope’s line of state-of-the-art X-ray inspection systems and microscopes.

SCIENSCOPE International


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