Industry News: bga and solder (Page 1 of 204)

HELLER Participates at the Beijing Intelligent Manufacturing and SMT Technology Exchange Conference

Industry News | 2023-06-12 21:14:11.0

The 2023 Beijing Intelligent Manufacturing and SMT Technology Exchange Conference, hosted by the Intelligent Manufacturing Committee of the Beijing Electronics Society, was successfully held in Beijing on May 25th. HELLER was honored to be invited and actively participated by sharing their cutting-edge technology and expertise.

Heller Industries Inc.

Heller Industries Opens New Office and Demo Center in Taoyuan, Taiwan

Industry News | 2023-03-30 22:45:02.0

Taoyuan, Taiwan (February 27, 2023) – Heller Industries, a leading provider of reflow and curing ovens for SMT and semiconductor advanced packaging, today announced the opening of a new office in Taoyuan, Taiwan, to meet the growing demand for reflow and curing equipment in the Taiwan region.

Heller Industries Inc.

Investment Boosts SMT Placement and Rework

Industry News | 2003-06-04 09:19:23.0

With increasing demand for fine pitch placements and a growing amount of fast turnaround high-tech low-volume prototype work, Speedboard has invested in additional SMT/BGA placement/rework equipment.

SMTnet

YXLON International and MIRTEC Announce Close Cooperation Empowering Industry 4.0 in the Electronics Production Market

Industry News | 2015-05-07 19:28:29.0

MIRTEC announce a new strategic cooperation that will empower yield improvement in the electronics manufacturing industry.

MIRTEC Corp

MIRTEC to Exhibit Award-Winning Line of 3D AOI and SPI Inspection Systems at SMTAI 2013

Industry News | 2013-09-13 17:01:33.0

MIRTEC, “The Global Leader in Inspection Technology”, will exhibit its award-winning line of 3D AOI and SPI Inspection Systems at SMTAI 2013 booth #722. This three-day event is scheduled to take place October 15-16, 2013 at the Fort Worth Convention Center in Texas.

MIRTEC Corp

MIRTEC to Exhibit Complete Line of 3D AOI and SPI Inspection Systems at IPC APEX 2014

Industry News | 2014-02-17 20:17:14.0

MIRTEC, “The Global Leader in Inspection Technology”, will premier its complete line of 3D AOI, and SPI Inspection Systems at IPC APEX 2014 booth #2263.

MIRTEC Corp

MIRTEC to Exhibit Complete Line of Technologically Advanced 3D AOI and SPI Inspection Systems at IPC APEX 2015

Industry News | 2015-01-21 21:05:20.0

MIRTEC, “The Global Leader in Inspection Technology,” will premier its complete line of 3D AOI and SPI Inspection Systems in Booth #2333 at the 2015 IPC APEX EXPO. The premier technical conference and exhibition for the electronics manufacturing industry will take place Feb. 24–26, 2015 at the San Diego Convention Center.

MIRTEC Corp

MIRTEC to Exhibit Extensive Range of AOI, SPI, X-ray and Specialized LED Inspection Systems at IPC APEX 2012

Industry News | 2012-01-23 00:02:12.0

MIRTEC, “The Global Leader in Inspection Technology”, will premier its complete line of 3D AOI, SPI, X-ray and LED inspection systems at the IPC APEX Expo in booth #3637.

MIRTEC Corp

MIRTEC to Exhibit Complete Line of 3D AOI, SPI and LED Inspection Systems at IPC APEX 2013

Industry News | 2013-01-16 11:21:12.0

MIRTEC, “The Global Leader in Inspection Technology”, will premier its complete line of 3D AOI, SPI and LED Inspection Systems at IPC APEX 2013

MIRTEC Corp

MIRTEC to Exhibit Complete Line of Technologically Advanced 3D AOI and SPI Inspection Systems at IPC APEX 2017

Industry News | 2017-01-11 18:22:38.0

MIRTEC, “The Global Leader in Inspection Technology,” will premier its complete line of 3D AOI and SPI Inspection Systems in Booth #3101 at the 2017 IPC APEX EXPO. The premier technical conference and exhibition for the electronics manufacturing industry will take place Feb. 14-16, 2017 at the San Diego Convention Center.

MIRTEC Corp

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