Industry News: bga rework solder mask peeled (Page 2 of 3)

MARTIN to Demonstrate BGA Reball/Pre-Bump Unit at the SMTA Space Coast Expo & Tech Forum

Industry News | 2011-05-10 19:11:40.0

MARTIN will showcase its Mini-Oven 04 Reball/Prebump unit at the upcoming Space Coast Expo and Tech Forum, scheduled to take place June 9, 2011 at the Melbourne Auditorium in Melbourne, FL.

MARTIN (a Finetech company)

Christopher Associates to Unveil New SPI Unit at the 2012 IPC APEX Expo

Industry News | 2012-01-21 01:10:32.0

Christopher Associates announced plans to unveil a new SPI unit in Booth #2801 at the upcoming IPC APEX Expo.

Christopher Associates Inc.

MARTIN to Demonstrate Mini-Oven Reball/PreBump Unit at the Mississauga EPTECH Electronics Show

Industry News | 2012-09-26 07:31:28.0

MARTIN will showcase its Mini-Oven Reball/Prebump unit and Expert 10.6 rework system at the upcoming Mississauga EPTECH Electronics Show,

Finetech

VJ Technologies to Showcase Leading Processes at APEX 2010

Industry News | 2010-03-27 18:27:23.0

VJ Technologies, Inc., the leader in Rework technologies and global provider of advanced X-ray inspection systems, announces that it will exhibit and demonstrate X-ray and Rework solutions in booth 2059 at the upcoming IPC/APEX conference and exhibition.

VJ Electronix

MARTIN to Demonstrate Stand Alone QFN Solder Bumping and BGA Reball Unit at the CTEA Austin Expo & Tech Forum

Industry News | 2010-10-04 15:37:18.0

MARTIN will demonstrate the Prebump/Reball 03.1 unit at the upcoming Central Texas Electronics Association (SMTA/IMAPS) Expo & Tech Forum, scheduled to take place, October 7, 2010 at the Norris Conference Centers in Austin, TX.

Finetech

MARTIN to Demonstrate Stand Alone QFN Solder Bumping and BGA Reball Unit at the SMTA Arizona-Sonora Expo & Tech Forum

Industry News | 2010-11-18 11:04:08.0

MARTIN will demonstrate the Prebump/Reball 03.1 unit at the upcoming SMTA Arizona-Sonora Expo & Tech Forum, scheduled to take place Wednesday, December 1, 2010 at the Fiesta Inn Resort & Conference Center in Tempe, AZ.

Finetech

MARTIN to Demonstrate Standalone QFN Solder Bumping and BGA Reball Unit at SMTA Capital Expo

Industry News | 2010-09-15 21:55:19.0

MARTIN will demonstrate the Prebump/Reball 03.1 unit at the upcoming SMTA Capital Expo and Tech Forum, scheduled to take place Tuesday, September 21, 2010 at the Johns Hopkins University/Applied Physics Lab in Laurel, MD.

Finetech

See the Fully Configured SRT Micra from VJ Electronix at the 2012 IPC APEX Expo

Industry News | 2012-01-24 16:12:56.0

VJ Electronix will display a fully configured SRT Micra Rework Platform in Booth #3051 at the upcoming IPC APEX Expo.

VJ Electronix

MARTIN to Demonstrate Affordable Rework System and Mini-Oven Reball/PreBump Unit at SMTAI 2011

Industry News | 2011-09-19 16:30:56.0

MARTIN will showcase its Mini-Oven Reball/Prebump unit and Expert 10.6 rework system in Booth #407 at the upcoming SMTA International Conference & Exhibition.

MARTIN (a Finetech company)

MARTIN to Demonstrate Mini-Oven Reball/Solder Bumping Unit at SMTA LA/Orange County Expo

Industry News | 2011-10-07 23:08:54.0

MARTIN will showcase its Mini-Oven Reball/Solder Bumping unit at the upcoming SMTA LA/Orange County Expo & Tech Forum.

MARTIN (a Finetech company)


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