Industry News | 2023-10-31 18:58:18.0
SHENMAO America, Inc. is proud to announce that it received a 2023 Mexico Technology Award for its groundbreaking SMBF-08 Visible No-Clean BGA Flux. The award was announced at a ceremony on Wednesday, Oct. 25, 2023 during the SMTA Guadalajara Expo. This innovative flux has redefined surface mount technology (SMT) assembly and BGA ball mount processes, offering unparalleled visibility and performance.
Industry News | 2021-08-25 16:20:31.0
Two additional Hentec/RPS Odyssey 1325 RHSD machines will expand high reliability BGA alloy exchange and component re-finishing capabilities.
Industry News | 2016-06-05 13:20:49.0
SHENMAO PF606-P116 Halogen Free Water Soluble LED Die Bonding Solder Pastes are made locally in the USA and with the same quality in 8 other worldwide locations.
Industry News | 2007-02-28 21:19:00.0
EdmondMarks Technologies is opening a new EMS facility in Neptune, New Jersey.
Industry News | 2008-01-28 23:33:58.0
Agilent Technologies Inc. (NYSE: A) today unveiled the industry's first DDR2 and DDR3 ball-grid array (BGA) probes for oscilloscopes and logic analyzers. The probes will be shown for the first time at DesignCon, here in Santa Clara, Feb. 4-6, 2008, Booth 305.
Industry News | 2010-09-26 16:12:24.0
STI Electronics, Inc., a full service organization providing training, electronic and industrial distribution, consulting, laboratory analysis, prototyping, and small- to medium-volume PCB assembly, announces that its BGA Reballer Kit allows components to be reused.
Industry News | 2021-02-09 12:28:27.0
Odyssey 1325 provides high reliability BGA alloy exchange and component re-finishing capabilities
Industry News | 2017-06-25 20:33:39.0
SHENMAO Technology, Inc. introduces New Generation Ultra Tacky Flux SMF-WC52 applied in the Flip Chip dipping process. Its high tacky property keeps Chip in place during reflow for excellent soldering performance, while creating outstanding solder joint strength.
Industry News | 2023-09-14 17:50:57.0
SHENMAO America, Inc. is proud to introduce its latest innovation in response to the growing demand for ultra-thin packages in the electronics industry. With the increase in package thinness, the challenge of package warpage and its impact on production yield has become more pronounced.
Industry News | 2011-09-23 22:09:26.0
Nordson DAGE announces that a Technical Paper entitled "The Last Will and Testament of the BGA Void" will be presented at the SMTA International Conference & Exhibition.
