Industry News: bleed out (Page 1 of 1)

Nordson Electronics Solutions introduces new Helios® system for dispensing single-component thermal interface materials

Industry News | 2022-05-05 17:28:46.0

Includes new, easy-to-operate pail pump with unique pail change and loading method, which also reduces material waste

Nordson Electronics Solutions

FINE LINE STENCIL Premiers Slic Blade™ Squeegee Blades

Industry News | 2008-06-11 18:26:39.0

FINE LINE STENCIL announces Slic Blade™, its newest line of squeegee blades, and a SMT VISION Award winning product.

FCT ASSEMBLY, INC.

Flextac Self-Adhesive Stencils Simplify BGA Rework

Industry News | 2001-02-26 11:18:45.0

Innovative Flextac Stencils simplify BGA rework. These self-sticking laser cut, polymer solder paste stencils use a residue-free adhesive similar to Post-it Notes to seal around BGA pads to ensure that solder paste will not bleed under the stencil when the paste is applied. Disposable Flextac Stencils are easy to use and will not leave any residue on the board surface.

Circuit Technology Center, Inc.

ACL Staticide® Introduces #8699 Heat Sink Grease

Industry News | 2019-11-29 10:08:57.0

Maximum Heat Transfer and Dissipation ACL Staticide® introduces the #8699 Heat Sink Grease to its existing array of PCB production, rework and repair products. ACL’s silicone-based Heat Sink Grease enables heat transfer away from electronic and electrical components. With its excellent conductivity, Heat Sink Grease is an effective thermal coupler for any heat sink surface.

ACL Staticide, Inc.

DEK Raises the Bar on DirEKt Coat™ Technology

Industry News | 2009-08-10 20:22:02.0

2@+/- 12.5µm and a 7µm Total Thickness Variation (TTV), DirEKt Coat wafer coating processes effectively address the needs of current and future thinned wafer products.

ASM Assembly Systems (DEK)

DEK Packaging and Solar Advancements on Display at Semicon West 2008

Industry News | 2008-06-26 14:36:27.0

Building on its decades of materials deposition expertise, DEK has developed several unique advanced technology systems to enable next-generation semiconductor packaging and solar cell production processes. At the upcoming Semicon West event, scheduled for July 15 � 17 at San Francisco�s Moscone Center, DEK will display some of these latest innovations along with its new VectorGuard� Platinum stencil technology.

ASM Assembly Systems (DEK)

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