Industry News: cm301 camera controller (Page 1 of 48)

Microscopes and Vision Products Suit SMD and PCB

Industry News | 2003-04-21 08:46:05.0

Kaisertech has added Meiji Techno microscopes and vision equipment to its range of electronic production equipment.

SMTnet

Nam Tai Electronics, Inc. Starts Investing in Image Sensor Manufacturing and Bluetooth� Wireless Technology Production

Industry News | 2003-06-10 08:56:19.0

Seeing the increasing number of electronic products having image capturing functions in the market, the Company has decided to seek to further augment its manufacturing capabilities to produce image sensors to satisfy order demand for these components.

SMTnet

International Rectifier Introduces Bi-Directional Dual MOSFET in the FlipFET Package

Industry News | 2003-01-29 13:23:31.0

A Common Drain Configuration that is 80% Smaller than Devices in the TSSOP-8 Package

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Nordson ASYMTEK Combines Conformal Coating and Inspection into One Automated System Ensures accurate and reliable coating process

Industry News | 2018-07-26 18:53:00.0

Nordson ASYMTEK a Nordson company announces an automated coating inspection (ACI) line combining its Select Coat® SL-940 Conformal Coating system with the FX-940UV Series ACI/AOI Automated Conformal Coat Inspection system. Together, the systems ensure a conformal coating process that's accurate and reliable, and delivers ongoing coating quality and consistency.

ASYMTEK Products | Nordson Electronics Solutions

Lee Air Selects Asymtek to Equip Aircraft Electronics Facility

Industry News | 2003-02-19 09:24:18.0

Recently Purchased an Asymtek Automove A-402 Dispensing System for Their Aviation Electronics Facility

ASYMTEK Products | Nordson Electronics Solutions

Nordson ASYMTEK's Helios™ SD-960 Series Automated Dispensing System dispenses medium and bulk volume deposits of single- (1K) and two-component (2K) fluids and supports highly abrasive

Industry News | 2018-03-22 21:11:24.0

Nordson ASYMTEK introduces the new Helios™ SD-960 Series Automated Dispensing System for medium and bulk volume deposits of single- (1K) and two-component (2K) materials in electronics manufacturing and printed circuit board assembly. The Helios system is ideal to deposit volumes greater than 1cc, and line widths and dots that exceed 1mm, but it can deposit volumes down to 0.3cc and line widths as narrow as 0.3mm. The system supports highly abrasive thermal interface materials (TIM), silicones, epoxies, and grease for applications such as potting, sealing, gasketing, and structural adhesives.

ASYMTEK Products | Nordson Electronics Solutions

Omron Demos High-Speed PCB Inspection Technology Solutions at the 2012 IPC Midwest Conference & Exhibition

Industry News | 2012-08-03 08:30:27.0

Omron Inspection Systems (www.omron247.com) will display and demo its latest concepts and enhancements in AOI systems at the 2012 IPC Midwest Conference & Exhibition

Association Connecting Electronics Industries (IPC)

IPC-7527 Establishes Two New Firsts for IPC

Industry News | 2012-08-08 17:44:58.0

IPC Recently released, IPC-7527 was the brainchild of Task Group Nordic (TGNordic), IPC’s volunteer standards development group in Scandinavia.

Association Connecting Electronics Industries (IPC)

Solder Paste Application Standard Available in Danish IPC-7527 Establishes Two Firsts for IPC

Industry News | 2012-12-13 13:23:38.0

IPC-7527, Krav til Tinpastatryk, is also the first standard ever developed that focuses on the application of one of the industry’s most basic infrastructure elements, solder paste.

Association Connecting Electronics Industries (IPC)

Nordson ASYMTEK's Programmable Tilt + Rotate Uses 5 Axes for Fluid Dispensing

Industry News | 2015-07-08 14:20:26.0

Nordson ASYMTEK, a Nordson company (NASDAQ: NDSN), a global leader in dispensing, jetting, and coating equipment and technologies, announces its new Programmable Tilt + Rotate 5-Axis Fluid Dispenser that enables the jet to dispense using 5 axes of automated control instead of only 3 axes. The additional X and Y tilt modes enable dispensing from a vertical position and at varying tilt angles along all four sides of a device and up the side of a substrate or component, especially for 3D packages, while meeting stringent requirements for precision, accuracy, and speed. It enables dispensing of underfill, encapsulant, and coating fluids around tall substrate components on PCBs, flexible circuits, and in densely populated boards; provides precision fluid delivery to multiple sides of the latest-generation mobile device cases and sub-component camera modules by moving the nozzle tip closer to a target location such as a vertical wall; and dispenses into tight corners and narrow gaps in advanced packages.

ASYMTEK Products | Nordson Electronics Solutions

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