Industry News | 2010-09-27 23:15:26.0
VJ Technologies, Inc., the leader in rework technologies and global provider of advanced X-ray inspection systems, announces that Intel’s James Wade and Raiyo Aspandiar, along with VJ Technologies’ Donald Naugler and Terry Leahy will present a paper titled “PCB Pad Site Dress Methods on BGA and Socket Pad Arrays” at the upcoming SMTA International, scheduled to take place October 24 - 28, 2010 at the Walt Disney World Swan and Dolphin Resort in Orlando, FL.
Industry News | 2014-10-13 16:23:05.0
Nikon Metrology will be presenting Inspect-X 4.1 at Electronica Munich from 11-14 November, their latest release of the acquisition and analysis software for Nikon Metrology's range of X-ray and CT systems. The new technology provides improved real-time imaging and advanced BGA analysis.
Industry News | 2002-01-22 14:37:07.0
Glenbrook Technologies has announced the availability of several upgrades to their newly developed X-ray image processing software, GTI-5000. The latest version software (version 1.06) has been upgraded to run in a Windows XT, Windows 2000, or Windows NT environment and perform complex inspection routines required for leading-edge packaging technologies like TBGA's, Super BGA's, DSP's as well as CSP's and microBGA's.
Industry News | 2022-11-21 15:39:24.0
PDR, founded in 1985 is pleased to announce the appointment of TechSystems as its newest manufacturers' representative. Under the agreement, Chris Putney, President of TechSystems, will represent PDR's SMD/BGA Rework and X-ray systems throughout Northern California.
Industry News | 2007-02-28 21:19:00.0
EdmondMarks Technologies is opening a new EMS facility in Neptune, New Jersey.
Industry News | 2015-04-15 18:32:24.0
Scienscope International has appointed Technical Marketing Company as its newest manufacturers’ representative. Technical Marketing Company will represent Scienscope’s state-of-the-art X-ray cabinet systems throughout the Rocky Mountain region.
Industry News | 2010-08-27 07:25:03.0
Package on Package (PoP) applications are growing in popularity for mobile and handheld professional electronics applications and with it placing further demands on assembly engineers.
Industry News | 2017-01-10 09:12:51.0
Scienscope International will exhibit in Booth #1331 at the 2017 IPC APEX EXPO, scheduled to take place Feb. 14-16, 2017 at the San Diego Convention Center in Calif. Company representatives will be available for live demonstrations of Scienscope’s various PCB X-ray inspection systems and X-ray Component Counter.
Industry News | 2021-08-13 08:37:00.0
Circuit Technology Center announces that it has recently purchased and commissioned an Oxford 980 X-Strata series XRF (x-ray fluorescence) system to support the testing of electronic components for restricted substances such as lead or tin above specified limits. The system can also verify the coating thickness. Defense base customers often require XRF verification testing of components after components have been processed through lead-free to leaded solder alloy exchange for tin mitigation applications. XRF testing may also be required to verify RoHS compliance of components that have been re-balled or re-processed for lead-free applications. In addition to XRF testing, Circuit Technology Center also supports ionic cleanliness testing, X-ray, Acoustic Microscopy, Solderability, and BGA ball shear testing services.
