Industry News: component terminations for rf applications (Page 7 of 9)

KYZEN Offers Tips for Improving Device Reliability at the SMTA Intermountain Expo

Industry News | 2015-04-07 17:14:44.0

KYZEN announces that David Lober presented during the recent SMTA Intermountain Expo at Boise State University. Mr. Lober presented “Improving Device Reliability When Building Highly Dense Assemblies.” For more than 25 years KYZEN consistently has delivered leading science connected to care in order to persistently create the most effective cleaning solutions for each customer’s unique manufacturing process or problem. Mr. Lober is part of KYZEN’s innovative new product technology team.

KYZEN Corporation

Naprotek Wins GLOBAL Technology Award for High-Mix, High-Quality, High-Velocity PCBA Manufacturing

Industry News | 2022-11-07 19:42:43.0

Naprotek, LLC. received a 2022 GLOBAL Technology Award in the category of Contract Services $50-100 Million. The award was announced during a ceremony that took place Wednesday, Nov. 2, 2022 during the SMTA International Conference and Exposition in Minneapolis, MN. Naprotek was selected among electronic manufacturing services providers based on excellence in first pass yield, accreditations, capabilities, markets served, environmental friendliness, prototyping turnaround and changeover speed.

Naprotek, Inc

Video Demonstration for HIOKI 1240 Flying Probe Tester with New Software Programming Feature Is Now Live on Seika TV

Industry News | 2013-04-18 11:08:20.0

Seika Machinery, Inc., announces that it has added a video demonstration of the HIOKI 1240 Flying Probe Tester with the new software programming feature to Seika TV.

Seika Machinery, Inc.

Lattice Semiconductor Announces Video Display Interfaces Suite for HDMI, DVI, and 7:1 LVDS

Industry News | 2010-09-28 12:18:33.0

Lattice Semiconductor Corporation (NASDAQ: LSCC) today announced the immediate availability of a comprehensive video display interfaces suite for High-Definition Multimedia Interface (HDMI 1.3a), Digital Visual Interface (DVI), and 7:1 LVDS Interface. All of these display interfaces are available as free Reference Designs for the award winning, mid-range LatticeECP3™, while selected free Reference Designs can also be ported to the LatticeECP2M™ and LatticeXP2™ FPGA families.

Lattice Semiconductor

The necessity of X-ray inspection for SMT BGA soldering quality control

Industry News | 2021-06-10 02:42:13.0

With the advent of 5G, especially the high integration, high density, miniaturization of packaging, and high process requirements in the electronics industry, detection efficiency is particularly important. Many manufacturers are not particularly clear about what role X-Ray can play and how to use X-Ray to improve the process and reduce the defect rate. Most manufacturers buy X-Ray because of the needs of customers. Those who are forced to buy X-Ray alone do not actually understand the important role that X-Ray can play in the production line.

Unicomp Technology Co., Ltd

New Yorker Electronics Releases Gowanda Electronics' Expanded Broadband Conical Line

Industry News | 2021-02-03 09:05:21.0

New Gowanda Broadband Conical Configurations Designed to Enhance Utility in Electronics Design

New Yorker Electronics

Averatek to Present "Surface Treatment for Soldering Aluminum PCBs to Conventional Copper PCBs" at IPC APEX EXPO

Industry News | 2021-10-31 04:57:58.0

Averatek is pleased to announce that VP of Manufacturing Divyakant Kadiwala will present the paper entitled, "Surface Treatment for Soldering Aluminum PCBs to Conventional Copper PCBs" during the IPC APEX EXPO Technical Conference, scheduled to take place Jan. 22-27, 2022 at the San Diego Convention Center in California. The paper was co-authored by Nazarali Merchant, Ph.D., Senior Materials Scientist for Averatek.

Averatek Corporation

Averatek to Present "Surface Treatment for Soldering Aluminum PCBs to Conventional Copper PCBs" at IPC APEX EXPO

Industry News | 2022-01-03 07:38:59.0

Averatek is pleased to announce that VP of Manufacturing Divyakant Kadiwala will present the paper entitled, "Surface Treatment for Soldering Aluminum PCBs to Conventional Copper PCBs" during the IPC APEX EXPO Technical Conference, scheduled to take place Jan. 22-27, 2022 at the San Diego Convention Center in California. The paper was co-authored by Nazarali Merchant, Ph.D., Senior Materials Scientist for Averatek.

Averatek Corporation

Preview for Seica SMT Nuremberg April 26-28, 2016, booth # 7A.425

Industry News | 2016-04-04 11:35:00.0

The theme for Seica at SMT this year will be automation and Industry 4.0. Highlights will include the traditional Compact line of bed of nails and functional testers; the Pilot line, a truly versatile and multi-faceted flying probe system, and the Firefly line, a premier laser selective soldering system.

SEICA SpA

Lattice Announces Five New IP Suites for the LatticeECP3 FPGA Family

Industry News | 2011-02-07 15:59:43.0

Lattice Semiconductor Corporation today announced the immediate availability of five new comprehensive Intellectual Property (IP) Suites to accelerate the design of electronic systems in a variety of industries using the award winning LatticeECP3™ FPGA family.

Lattice Semiconductor


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