Industry News | 2018-03-22 21:11:24.0
Nordson ASYMTEK introduces the new Helios™ SD-960 Series Automated Dispensing System for medium and bulk volume deposits of single- (1K) and two-component (2K) materials in electronics manufacturing and printed circuit board assembly. The Helios system is ideal to deposit volumes greater than 1cc, and line widths and dots that exceed 1mm, but it can deposit volumes down to 0.3cc and line widths as narrow as 0.3mm. The system supports highly abrasive thermal interface materials (TIM), silicones, epoxies, and grease for applications such as potting, sealing, gasketing, and structural adhesives.
Industry News | 2012-10-18 19:02:31.0
IPC and SMTA jointly announce the agenda for Session 2 of the High-Reliability Cleaning and Coating Conference, scheduled to take place November 13-15, 2012 at the Crowne Plaza Hotel
Industry News | 2017-10-05 12:40:41.0
The new whitepaper highlights the specific benefits of bentonite clay in terms of composition, moisture-adsorption performance, production requirements, and the environmental impact of available moisture controlled packaging solutions.
Industry News | 2019-11-05 22:16:43.0
Flex PCBs are thin, light weight and easy bending, this gives much difficulty in the process of component assembly. Stiffeners are used to reinforce those areas where components will be assembled. There are many different material can be used as stiffeners, like polyimide, kapton, FR-4, Aluminium, etc, designer need to select the right material based on their thickness and characteristics.
Industry News | 2009-03-19 16:46:09.0
Featured in Aerospace Manufacturing Design
Industry News | 2009-10-13 16:29:26.0
MADISON, AL — October 2009 — STI Electronics Inc., a full service organization providing training, electronic and industrial sales and distribution, consulting, laboratory analysis, prototyping, and small- to medium-volume PCB assembly, announces that Jim D. Raby, P.E. held a successful presentation at SMTA International. The presentation was held during session ET3 titled, “System in Packaging (SiP),” which took place Monday, October 5, 2009 from 1-2:30 p.m. in the California room at The Town and Country Resort and Convention Center in San Diego.
Industry News | 2011-03-14 17:29:48.0
Seika Machinery, Inc. introduces the SAYAKA SAM-CT35Q Large Board Model.
Industry News | 2022-10-20 06:45:08.0
Transition Automation, Inc. releases a new Universal Permalex Holder and Blade Assembly to install on Ersa SMT Printers.
Industry News | 2009-09-17 14:35:25.0
MADISON, AL — September 2009 — STI Electronics Inc., a full service organization providing training, electronic and industrial sales and distribution, consulting, laboratory analysis, prototyping, and small- to medium-volume PCB assembly, announces that Jim D. Raby, P.E., Mark McMeen, V.P. of Engineering Services, and Casey H. Cooper, Electrical Engineering Manager will give a presentation titled “Imbedded Die Assembly Process, Is It Ready Yet?” at the upcoming SMTA International, scheduled to take place October 6-7, 2009 at The Town and Country Resort and Convention Center in San Diego. The presentation will be held during session ET3 titled, “System in Packaging (SiP), which is scheduled to take place Monday, October 5, 2009 from 1-2:30 p.m. in the California room.
Industry News | 2008-03-26 00:42:45.0
World leading screen printing and mass imaging specialist DEK is to unveil a large area version of its Europa print platform at APEX. Called the Europa Vi, the new machine offers substrate printing to 24" x 24" (610mm x 610mm) on demand to meet the diverse volume, mix and size requirements of modern production environments.
