Industry News | 2018-10-18 09:49:44.0
NRE and Tooling Costs - What You Need to Know for Your PCB Project
Industry News | 2018-10-18 10:18:58.0
Case study: How to Create a Reflow Profile for a 16-layer, 2mm Thickness PCB with a High Density SMT Connector?
Industry News | 2019-03-10 20:30:11.0
The proliferation of tighter microvia densities and signal integrity requirements in printed boards within the electronics industry has revealed reliability concerns with microvia structures in high performance products. A number of IPC OEM member companies have approached IPC with examples of microvia failures in high-profile hardware that were not observed until after bare printed board fabrication, inspection and acceptance, including:
Industry News | 2019-04-23 07:43:52.0
IPC announces the release of IPC-2591, Connected Factory Exchange (CFX). The electronics industry now has an industry standard available to all companies in the industry, regardless of size or location which can be used to quickly and easily implement “Industry 4.0” and “smart factory” applications to their manufacturing operations.
Industry News | 2017-05-15 15:41:33.0
IPC's Validation Services Program has awarded an IPC-4101 Qualified Products Listing (QPL) to Taiwan Union Technology Corporation (TUC), an electronics materials manufacturing company headquartered in Jhubei, Hsinchu County, Taiwan. TUC provides mass lamination services, copper clad laminates and prepregs to the global electronics industry. To earn the QPL, TUC successfully completed an intensive audit based on IPC's foremost standard on base materials for laminates and prepregs: IPC 4101, Specification for Base Materials for Rigid and Multilayer Printed Boards.
Industry News | 2017-07-27 19:01:34.0
The SMTA and Chip Scale Review are pleased to announce the Keynote Presenters for the 14th annual International Wafer-Level Packaging Conference. The IWLPC will be held October 24-26, 2017 at the DoubleTree by Hilton Hotel in San Jose, California.
Industry News | 2024-10-06 19:52:39.0
The SMTA is thrilled to announce the launch of the Ultra HDI (UHDI) Learning Pavilion, a first-of-its-kind experience dedicated to advancing Ultra-High Density Interconnect technology. Taking place in booth #2753 during SMTA International, October 22-24, 2024 in Rosemont, Illinois, this interactive and educational pavilion is FREE and open to all attendees.
Industry News | 2003-07-08 09:48:46.0
taking place September 28-October 2, at the Minneapolis Convention Center in Minneapolis, Minn.
Industry News | 2003-08-27 10:58:00.0
Lead free solders and embedded passives headline professional development schedule at the 2003 IPC Annual Meeting
Industry News | 2021-04-15 11:58:44.0
The European Electronics Industry Has a Direct Impact on €3.8 Trillion of European GDP
