Industry News: connector stress (Page 1 of 3)

Surface-mount technology

Industry News | 2018-10-18 09:15:23.0

Surface-mount technology

Flason Electronic Co.,limited

Call for Participation — Deadline Extended to 2/21/20!

Industry News | 2020-02-18 14:31:52.0

Join us for High Reliability Forum as a presenter or instructor and share your expertise in electronics with high reliability requirements.

Association Connecting Electronics Industries (IPC)

Best Technical Paper at IPC APEX EXPO 2017 Selected

Industry News | 2017-02-07 15:46:59.0

The best technical conference paper of IPC APEX EXPO® 2017 has been selected. Voted on through a ballot process by members of the IPC APEX EXPO Technical Program Committee, the paper authors will receive their awards during the opening keynote session on Tuesday, February 14.

Association Connecting Electronics Industries (IPC)

6 Things to Check Before Submitting Your PCB Design for Manufacturing

Industry News | 2018-10-18 11:23:54.0

6 Things to Check Before Submitting Your PCB Design for Manufacturing

Flason Electronic Co.,limited

4th International Symposium on Tin Whiskers

Industry News | 2010-02-23 16:29:14.0

The Center of Advanced Life Cycle Engineering at the University of Maryland in collaboration with The Institute of Scientific and Industrial Research (ISIR) at Osaka University is pleased to announce the call for participation for the Fourth International Symposium on Tin Whiskers.

CALCE Center for Advanced Life Cycle Engineering

Henkel Launches New Fast Cure Silicone Ideal for Added Stability within Harsh Environments

Industry News | 2008-04-22 21:03:49.0

To offer added protection and stability for a wide range of electronics applications, Henkel has developed and made commercially available Loctite� 5210�, a new fast cure thixotropic silicone material ideal for devices that find end-use within harsh environments. With improved production throughput, operating temperature flexibility and easy storage, Loctite 5210 offers manufacturers a cost-effective alternative to traditional hot-melt glues or less aesthetically pleasing silicones.

Henkel Electronic Materials

MTCM for MOST150 Coax Physical Layer Testing

Industry News | 2016-04-20 09:33:40.0

RUETZ SYSTEM SOLUTIONS Introduces MOST Tester Cable Model as New Extension for Physical Layer Stress Test Tool

RUETZ SYSTEM SOLUTIONS GmbH

New Yorker Electronics Releases Expanded VPG C4A Series Stress Analysis Strain Gage Sensors

Industry News | 2021-01-19 13:51:42.0

New Micro-Measurements Advanced Sensors Technology C4A Series Strain Gages Enable Easy, No-Solder Installation

New Yorker Electronics

Indium Corporation Technology Experts to Lead Technical Sessions at SMTAi 2014.

Industry News | 2014-07-29 12:33:11.0

Several Indium Corporation technology experts will lead technical sessions at the Surface Mount Technology Association's International Conference and Exhibition (SMTAi) from Sept. 28-Oct. 2 in Rosemont, Ill.

Indium Corporation

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