Industry News | 2006-04-17 11:14:44.0
Indium Corporation�s NF260 No-Flow Underfill was awarded the 2006 EM Asia
Industry News | 2009-09-17 15:00:44.0
OSAKA, JAPAN — September 2009 — Nihon Superior Co. Ltd., a supplier of advanced soldering and brazing materials to the global market, announces that research sponsored by the company was recognized by the University of Queensland as one of the best examples of a successful cooperation between the university and the industry.
Industry News | 2023-09-25 17:55:00.0
Indium Corporation R&D Manager, Alloy Group and Principal Research Metallurgist Dr. HongWen Zhang will present at the SMTA Empire Expo & Tech Forum on September 26 in Syracuse, NY. Also at the conference, Regional Sales Manager Emily Belfield will host a panel discussion, Generational Differences in Today's Workplace.
Industry News | 2014-10-01 19:42:59.0
Gen3 Systems Limited sponsors the IPC Europe High-Reliability Forum, scheduled to take place Oct. 14-15, 2014 in Düsseldorf, Germany.
Industry News | 2020-10-27 12:41:51.0
SHENMAO America, Inc. received a 2020 Mexico Technology Awardin the category of Solder – Bar & Wire for its PF606-F13 lead-free and halogen-free solder wire.The award was announced during a Virtual Awards Ceremony on Monday, October 26, 2020.
Industry News | 2012-04-10 14:47:49.0
The Balver Zinn/Cobar Group announces that its SN100C Wire Solder and Cobrush flux applicator were demonstrated at the first Hand Solder Competition at the recently held IPC APEX EXPO in San Diego.
Industry News | 2020-05-25 13:28:07.0
SHENMAO America, Inc. is pleased to introduce its new PF606-F13 lead-free and halogen-free solder wire designed for automatic soldering equipment. The new solder wire enhances high-precision soldering, soldering efficiency and offers stable soldering quality.
Industry News | 2022-12-21 10:42:04.0
Nihon Superior Co. Ltd. is pleased to announce that it will exhibit its TempSave series in Booth #1433 at the IPC APEX Exposition, scheduled to take place Jan. 24-26, 2023 at the San Diego Convention Center in San Diego, CA. The company also will showcase LF-C2 P608 solder paste.
Industry News | 2011-01-14 13:06:07.0
Nihon Superior Co. Ltd. will exhibit in Booth # East 30-14 at the upcoming INTERNEPCON JAPAN, scheduled to take place January 19-21, 2011 at the Tokyo Big Sight in Tokyo, Japan.
Industry News | 2021-01-19 13:51:42.0
New Micro-Measurements Advanced Sensors Technology C4A Series Strain Gages Enable Easy, No-Solder Installation
