Industry News: definations (Page 7 of 72)

IPC E-Textiles 2019 to Address the Real World of E-textiles Applications for Multiple End Markets Drexel University Center for Functional Fabrics in Philadelphia to host event, September 10-11

Industry News | 2019-08-12 20:12:26.0

IPC E-Textiles 2019, a two-day technical education workshop for innovators, technologists and OEMs/brands to learn about the latest developments, designs and manufacturing concepts in the converging industries of textiles and electronics, will feature 14 technical presentations, tours of the Drexel Center for Functional Fabrics, a special interactive session and an IPC D-70 E-Textiles Committee Standards meeting. IPC E-Textiles will take place at the Drexel University Center for Functional Fabrics in Philadelphia, Pa., September 10-11.

Association Connecting Electronics Industries (IPC)

IPC Honors Apple, Inc. and MacDermid Alpha Electronic Solutions with Corporate Recognition Awards

Industry News | 2022-02-07 17:16:04.0

IPC presented its highest corporate honors to two IPC member companies, Apple Inc., and MacDermid Alpha Electronic Solutions during the IPC Annual Meeting/Awards Ceremony at IPC APEX EXPO 2022. The Peter Sarmanian Corporate Recognition Award was presented to MacDermid Alpha Electronics Solutions, and the Stan Plzak Corporate Recognition Award was presented to Apple, Inc.

Association Connecting Electronics Industries (IPC)

CHIPS Act Implementation Requires Strong Focus on "Advanced Packaging," Industry Leaders Say

Industry News | 2022-10-11 17:18:48.0

Ever-more complex packaging of chips will be the key driver of future innovation, yet the United States and Europe are behind the curve

Association Connecting Electronics Industries (IPC)

Revolutionize Electronics Manufacturing with the Intelligent SMD Storage System

Industry News | 2023-10-27 06:33:27.0

In today's fast-paced electronics manufacturing landscape, where efficiency and innovation are paramount, the Intelligent SMD Storage System (ISM2000) emerges as a groundbreaking solution under the esteemed I.C.T brand. This innovative system not only embodies European manufacturing excellence but also reflects I.C.T's forward-thinking approach to supply chain expansion by integrating European manufacturers. It harmoniously combines European craftsmanship with competitive Chinese pricing, delivering unparalleled cost-effectiveness.

I.C.T ( Dongguan Intercontinental Technology Co., Ltd. )

IPC Attains U.S. Dept. of Labor Approval of its National Apprenticeships Standards, First-Ever in U.S. Electronics Manufacturing Industry

Industry News | 2023-11-20 15:17:13.0

Industry group reports five-year growth in electronics workforce programs as it celebrates National Apprenticeship Week

Association Connecting Electronics Industries (IPC)

Elevating Precision Manufacturing: A Comprehensive Guide to Electrostatic Discharge Systems

Industry News | 2023-12-25 12:30:53.0

Precision manufacturing, especially in Surface Mount Technology (SMT) production, demands meticulous attention to detail. Among the myriad challenges faced, Electrostatic Discharge (ESD) emerges as a formidable threat to electronic components. In this article, we embark on a journey through the intricacies of ESD systems, underscoring their pivotal role in fortifying production lines against potential disruptions.

I.C.T ( Dongguan Intercontinental Technology Co., Ltd. )

Optimize Production with I.C.T's IC Burning Machine

Industry News | 2024-01-05 07:40:30.0

Explore I.C.T's IC Burning Machine for unmatched precision, high-speed programming, and versatile compatibility. Elevate your electronics manufacturing with our future-ready solutions.

I.C.T ( Dongguan ICT Technology Co., Ltd. )

iNEMI/IPC White Paper on Complex Integrated Systems Highlights Future Technology and Manufacturing Ecosystem Needs

Industry News | 2024-03-26 13:55:04.0

Today's system solutions combine more varied functionality, such as digital, analog, optical, micro-mechanical, etc., packed into smaller form factors. As a result, electronics manufacturing has to deliver increasingly complex integration of diverse technologies with system designs that blur the distinction between chip, package, board, and assembly.

Association Connecting Electronics Industries (IPC)

IPC RELEASES NEW REVISION OF SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD

Industry News | 2010-07-22 22:37:02.0

IPC — Association Connecting Electronics Industries® has released the B revision of IPC-7351, Generic Requirements for Surface Mount Design and Land Pattern Standard. The leading industry standard for surface mount land pattern design and layout, IPC-7351B provides designers and printed board fabricators with updated guidance on requirements of land pattern geometries used for the surface attachment of electronic components, as well as surface mount design recommendations for achieving the best possible solder joints.

Association Connecting Electronics Industries (IPC)


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