Industry News: dek 248 table problem (Page 1 of 1)

Process Fills Vias Faster than Squeegees

Industry News | 2003-03-11 09:04:04.0

Developed in response to customer requirements, the new Via Fill process from DEK delivers 100% fill of substrate vias with no voids and minimal surface residue.

ASM Assembly Systems (DEK)

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