Industry News: dek ela 03 (Page 7 of 10)

High-speed solar-cell metallization platform cuts delivery times, leverages global support infrastructure

Industry News | 2008-03-15 15:57:29.0

Heralding a new era of responsive and flexible metallization solutions available at fast turnaround, DEK has introduced the PVP1200 screen printer capable of 1200 wafers-per-hour throughput and offering advanced automated features for high speed and repeatability. The first showing of this new printer will be at BTU�s Solar Lab Grand Opening, in Shanghai, 18-19 March 2008.

ASM Assembly Systems (DEK)

DEK Solar prepares to showcase pioneering PV3000 at AsiaSolar Energy Photovoltaic Exhibition and Forum

Industry News | 2010-03-15 12:51:59.0

DEK Solar will be bringing its newly-introduced PV3000 metallization line to this year’s AsiaSolar Energy Photovoltaic Exhibition and Forum, being held at Shanghai Mart from 30th March – 1st April. In addition to providing an opportunity for visitors to see the line in action, the exhibition will also enable attendees to find out more about the company's innovative approach to service and support.

ASM Assembly Systems (DEK)

Great Lakes Engineering Licenses DEK VectorGuard® Technology

Industry News | 2011-08-03 22:04:06.0

Recognizing the benefits of DEK’s award-winning VectorGuard® stencil technology, Great Lakes Engineering today announced that it has signed a licensing agreement with DEK which will enable the Maple Grove, Minnesota-based stencil manufacturer to supply VectorGuard products to its customer base.

ASM Assembly Systems (DEK)

DEK sweeps five leading industry awards at NEPCON China 2011

Industry News | 2011-06-01 22:49:41.0

The world’s leading mass imaging equipment supplier, DEK International, was conferred a total of five leading industry awards at NEPCON China 2011 for its outstanding product performance and innovative solutions applicable to electronics assembly.

ASM Assembly Systems (DEK)

DEK and Gore Introduce snapSHOT� Board-Level EMI Shielding Solution

Industry News | 2003-02-14 08:03:50.0

Provides Devices with Excellent Protection Against EMI and Overcomes Limitations of Metal Cans

ASM Assembly Systems (DEK)

DEK Unveils Large Print Area Photon Platform at Nepcon Shanghai

Industry News | 2008-03-24 22:24:18.0

World leading screen printing and mass imaging specialist DEK is to unveil a large area version of its Photon print platform at Nepcon Shanghai. Called the Photon Vi, the new machine offers substrate printing to 24" x 24" (610mm x 610mm) on demand to meet the diverse volume, mix and size requirements of modern production environments.

ASM Assembly Systems (DEK)

Saline Lectronics Purchased the Stinger Dispensing Add on for PCBs Exposed to Critical Environments

Industry News | 2016-08-09 19:59:05.0

Saline Lectronics, Inc., a leading electronics contract manufacturer, recently installed the Stinger on its DEK Horizon 03iX printer used on a high-volume SMT Line. The company plans to add the Stinger to its other DEK printers in the future.

Saline Lectronics, Inc

DEK and Maxim SMT Technologies showcase latest innovations at Electronics Next 2010

Industry News | 2010-02-08 12:16:04.0

DEK is preparing to showcase a comprehensive range of advanced technologies and processes at this year’s Electronics Next exhibition in conjunction with the company’s agent Maxim SMT Technologies Pvt. Ltd. Being held in New Delhi over February 24th – 26th, Electronics Next will see the mass imaging specialist demonstrate its state-of-the-art Horizon screen printing platform along with award-winning Productivity Tools from Stand 501.

ASM Assembly Systems (DEK)

DEK and PacTech Join Forces for High-Volume Wafer Bumping Solution

Industry News | 2003-06-13 10:10:58.0

By combining PacTech's electroless under bump metallization (UBM) processing with DEK's advanced mass imaging systems to create the solder bumps, users can implement a wafer-level, SMT-compatible flip chip assembly process.

ASM Assembly Systems (DEK)

Process Fills Vias Faster than Squeegees

Industry News | 2003-03-11 09:04:04.0

Developed in response to customer requirements, the new Via Fill process from DEK delivers 100% fill of substrate vias with no voids and minimal surface residue.

ASM Assembly Systems (DEK)


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