Industry News | 2014-01-31 00:23:23.0
Indium Corporation announces a new solder paste technology. BiAgX™ is a high-melting lead-free (Pb-free) solder paste technology designed for high reliability electronics assembly applications. Designed as a drop-in replacement for standard high Pb-containing solder pastes, it has passed MSL1 and thermal cycle testing at several power semiconductor customers.
Industry News | 2005-09-09 09:59:58.0
Indium Corporation of America will be exhibiting their Pb-Free Suite of Materials at the Assembly Technology Expo in Rosemont, IL on Sept. 26-28, 2005
Industry News | 2004-10-15 16:35:07.0
To meet the high demand of water-soluble solder paste users who need to comply with the Pb-Free requirements, Indium Corporation of America has developed the next generation of Pb-Free Solder Paste, Indium3.1.
Industry News | 2021-12-17 16:30:28.0
One of the most highly demanded applications for 80Au20Sn is semiconductor laser die-attach due to recent advancements that have made lasers an economical option for a multitude of new products. However, a key challenge with semiconductor lasers is thermal management, as these devices generate a significant amount of heat. Indium Corporation Product Specialist Jenny Gallery will present on how to manage heat with AuSn preforms at SPIE Photonics West, Jan. 22-27, San Francisco, Calif., U.S.
Industry News | 2005-10-05 00:37:49.0
Indium Corporation�s Pb-Free Programs Manager, Tim Jensen, will discuss The Impact of Pb-Free Alloy Selection on the SMT Process at the SMTA/IMAPS show on October 11, 2005.
Industry News | 2007-04-11 23:01:30.0
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Industry News | 2007-05-02 12:18:23.0
Indium Corporation�s Indium5.1AT Pb-Free Solder Paste was awarded the Innovation Award at Nepcon China in Shanghai, China.
Industry News | 2004-09-22 14:23:28.0
Indium Corporation of America has introduced Wave Solder Flux 3592-35 specifically developed for the Pb-free wave soldering of mixed-technology and through-hole electronic assemblies.
Industry News | 2005-01-08 03:31:32.0
Indium Corporation of America will be exhibiting at IPC Printed Circuits Expo, APEX, the Designers Summit in Anaheim, CA on February 22-24, 2005.
Industry News | 2022-02-10 17:05:35.0
The development of a novel high-temperature lead-free solder for die-attach in power discrete applications will be the focus of a presentation by Indium Corporation's Dr. HongWen Zhang at APEC 2022, March 20-24, Houston, Texas, U.S.
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