Industry News | 2003-03-06 08:43:16.0
Under pressure to fulfill growing repair obligations in the United States, some OEMs and EMS companies are outsourcing projects to product-lifecycle managers.
Industry News | 2003-05-02 08:01:53.0
Flexstrip cable jumpers provide multiconductor board-to-board connection without wire stripping, cutting to length or solder preparation.
Industry News | 2003-06-26 09:02:38.0
The surface quality of printed circuit boards and components directly impacts performance and product life.
Industry News | 2003-03-12 08:28:44.0
CAM350 Release 8 is aimed at allowing engineering and manufacturing groups to detect and fix potential PCB fabrication problems earlier in the process.
Industry News | 2003-05-30 08:26:20.0
The inventors of this module type and holders of the patent are chief technical officer Kenneth J. Kledzik and president Jason C. Engle, both of San Clemente, California.
Industry News | 2003-05-28 08:28:54.0
For June 2-4 (Mon. - Wed.)Design Automation Conference 2003
Industry News | 2015-05-18 21:29:50.0
The SMTA Capital Chapter is pleased to announce its second meeting of 2015 on May 28th, scheduled from 5:30 pm to 8:00 pm at NTS Baltimore formerly Trace Labs, 5 North Park Drive, Hunt Valley, MD 21030. The focus of this chapter meeting will be “Failure Analysis Process for Printed Board Assemblies” presented by John M. Radman, Senior Applications Engineer, NTS Baltimore.
Industry News | 2021-08-13 12:58:35.0
The SMTA Capital Chapter, Carolinas Chapter and Philadelphia Chapter are excited to host their first ever tri-chapter event, Mid-Atlantic Advanced Learning Session - Failure is Never an Option, A Deep Dive into Failure Analysis.
Industry News | 2022-05-27 14:34:04.0
From battery fires to non-functional charging stations, from dendrites to poor cable connections, electronic system failures have caused massive recalls. Failures are increasing significantly, not because of quality, but because of usage and implementation of technology. As the expected lifetime usage of parts increases and technology applications change, materials, approaches, and test parameters must change as well.
