Industry News: filling vias with solder (Page 5 of 10)

A New Look with New Capabilities – Check Out the Newly Designed SolderLab.com

Industry News | 2014-05-15 16:46:41.0

SolderLab.com, an independent solder analysis lab, announces its newly redesigned Web site, complete with a new look and capabilities.

SolderLab.com

Get a Free ERSA Mobile Scope with Purchase of ERSA Rework System

Industry News | 2011-10-28 20:29:08.0

ERSA is pleased to offer a free ERSA Mobile Scope with the purchase of an ERSA rework system. The ERSA Mobile Scope is a new portable video microscope designed to inspect hidden solder joints of ball grid arrays (BGAs), μBGAs, chip scale packages (CSPs) and flip chips.

kurtz ersa Corporation

Kurtz Ersa expands Mexico presence with new demo & technology center in Guadalajara

Industry News | 2016-10-30 20:48:24.0

Kurtz Ersa North America is pleased to announce the grand opening of its new demo & technology center in Guadalajara. Located at Av. Lopez Mateos Sur No. 1450 Int. L-7A, Col. Las Amapas, Tlajomulco de Zuniga, Jalisco, the grand opening celebration is scheduled to take place Nov. 17, 2016. Ersa continues to stay ahead of the curve with its award-winning reflow, rework, and selective soldering technologies, and the event will focus on the company’s future growth in Mexico and emerging technologies for its customers.

kurtz ersa Corporation

Viscom to Exhibit 3-D SPI Unit with SPI-AOI Uplink at the IPC APEX Expo

Industry News | 2012-01-19 23:09:10.0

Viscom proudly announces that it will exhibit its recently introduced 3-D SPI system in Booth #2629 at the upcoming IPC APEX Expo. The system is now available with the unique SPI-AOI Uplink feature that provides better defect detection during post-reflow AOI, ensuring the lowest false alarm rates.

Viscom AG

AI Technology (AIT) Introduces Novel High Temperature Large Area Underfill with Proven Stress Absorption

Industry News | 2014-07-28 13:56:52.0

240°C and novel stress absorbing capabilities to allow long-term reliability of large area flip-chip devices.

AI Technology, Inc. (AIT)

Gen3 Systems to Exhibit with Ascentech LLC at the IPC APEX EXPO

Industry News | 2014-02-19 16:31:37.0

Gen3 Systems Limited will be exhibiting at IPC APEX EXPO alongside their American Distributor, Ascentech LLC, They will be present on Booth #2541 at the IPC APEX Expo.

Gen3 Systems

FCT and Fine-Line Stencil Expand Market Presence with New Facility in Guadalajara, Mexico

Industry News | 2015-06-08 13:50:26.0

FCT Companies, a leading chemistry, electronic stencil and specialty manufacturing business, announces the official opening of its new state-of-the-art facility in Guadalajara, Mexico. While FCT has long had a significant presence in Mexico through sales, service and distribution, the company’s Fine-Line Stencil operation in Guadalajara marks its first manufacturing site in the region and is a noteworthy addition to the broad FCT offering.

FCT ASSEMBLY, INC.

NEPCON China Delivers Stability in Uncertain Times with Another Record Turnout for Shanghai Event

Industry News | 2009-06-02 13:35:12.0

Despite the grip of a global economic downturn, the Chinese electronics manufacturing industry once again came out in force to support its leading exhibition platform, NEPCON. In spite of the difficult times faced by the industry, NEPCON China is still on the up and up, continuing to demonstrate its status as the most important event for the Chinese SMT community.

Reed Exhibitions

ORPRO Vision to exhibit at SMTAI 2010 with partners PFI of Florida, Inc.

Industry News | 2010-10-06 10:56:18.0

ORPRO Vision will feature information on its complete line of AOI and SPI systems at SMTA International 2010, scheduled to take place October 26-27 at Walt Disney World Swan and Dolphin Resort Orlando, Florida. ORPRO Vision’s representative in Florida, and partner for the show, PFI of Florida, Inc., invites all visitors to attend booth 639.

Orpro Vision GmbH

FINETECH to Showcase Chip-to-Wafer Packaging with Sub-Micron Bonder at Photonics West 2009

Industry News | 2009-01-16 17:14:22.0

FINETECH will showcase chip-to-wafer bonding with the sub-micron placement accuracy FINEPLACER� Femto at the upcoming Photonics West exhibition (booth 519) in San Jose, CA, January 27-29, 2009

Finetech


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