Industry News | 2010-04-19 12:56:32.0
BANNOCKBURN, Ill., USA, - The world’s most widely used standards for printed boards and electronic assemblies were recently updated, providing new coverage for advanced technologies and processes as well as guidance on the new challenges that state-of-the-art can bring. To help industry members understand the ramifications of the changes to the standards that they and their customers depend on, IPC will host a number of full-day technology workshops, taught by the leaders of the task groups that worked on the standards’ revisions.
Industry News | 2017-06-08 15:11:11.0
The SMTA is pleased to announce that the program for the SMTA International Conference and Exhibition is finalized and available on-line at www.smta.org/smtai and registration is open. Taking place September 17-21, 2017 at the Donald Stephens Convention Center in Rosemont, Illinois, the conference features 20 workshops, 130 technical papers, and numerous complimentary offerings for engineers and professionals in the electronics manufacturing industry.
Industry News | 2016-10-25 09:47:33.0
Learn about SMT assembly from SME Phil Zarrow in Chicago
Industry News | 2009-07-10 13:30:57.0
Free LED Board Keychain from Saturn Electronics Corporation
Industry News | 2006-06-23 16:19:47.0
Group Addresses Assembly Process and Reliability Requirements for SnPb and Pb-free Modules
Industry News | 2018-10-18 10:16:53.0
Solder Tinned Pads vs Gold Plated Pads - The Importance of Selecting the Proper Surface Finish
Industry News | 2009-02-11 23:22:16.0
ndium8.9HF Solder Paste is a halogen-free Pb-free solder paste with unsurpassed print transfer efficiency and response-to-pause printing. The advanced rheology of Indium8.9HF is ideally suited for today's advanced 0.4mm pitch and 0201 technologies.
Industry News | 2014-05-13 17:01:55.0
Indium Corporation's Graham Wilson, applications engineer, will present at Brasage in Brest, France on Friday, May 23. Wilson's presentation, Elimination of Head-in-Pillow in PoP Assembly: A Flux Approach, discusses eliminating head-in-pillow defects in the package-on-package (PoP) assembly process by engineering unique attributes of the flux chemistries of dipping fluxes and pastes.
Industry News | 2019-06-30 21:03:39.0
KYZEN is pleased to announce that Chelsea Jewell, Application Lab Manager, has been selected to the Products Finishing 40-Under-40 class for 2019. Jewell was recognized at the NASF Sur/Fin show on June 4, 2019 in Chicago.
Industry News | 2022-05-05 17:32:51.0
KYZEN is proud to announce that Ethan Mueller, its regional manager – Midwest, received a 2022 40 Under 40 Award from Products Finishing Magazine. The program is designed to recognize emerging leaders in the surface finishing industry. Annually, Products Finishing editors examines a long list of nominees with a wide range of skill sets. The recipients are chosen based on leadership and industry involvement.
