Industry News: flex delamination (Page 1 of 1)

Updates to IPC-6012 and IPC-A-600 Released: Five Years of New Board Technologies and Processes Bring Significant Changes to Specifications.

Industry News | 2010-04-10 02:09:54.0

If a picture is worth a thousand words, the new H revision of IPC-A-600, Acceptability of Printed Boards, is a priceless work of art for fabricators and assemblers, particularly inspectors and product developers. IPC — Association Connecting Electronics Industries® announces the new releases of IPC-A-600H and its companion document the C revision of IPC-6012, Qualification and Performance Specification for Rigid Printed Boards.

Association Connecting Electronics Industries (IPC)

January 25-27, San Diego, CA – Booth 1100

Industry News | 2022-01-10 16:28:20.0

Once again, customers looking for leading-edge test solutions can come to Seica's booth 1100 and view the future of Flying Probe test in the form of the new PILOT VX platform. Fast, Powerful and Smart: the Pilot VX raises the bar of flying probe test performance, with cutting-edge solutions that address the fundamental concerns of electronic board manufacturers looking to optimize their investment.

SEICA SpA

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