Industry News: flex depanel (Page 1 of 3)

New Tutorial Released With IPC-2223C Provides Expert Advice and Tips for Designers Working With Flexible Circuits

Industry News | 2012-03-28 08:47:23.0

he industry standard that establishes the specific requirements for the design of flexible and rigid –flexible printed boards, IPC-2223, Sectional Design Standard for Flexible Printed Boards, has been recently updated to its C revision.

Association Connecting Electronics Industries (IPC)

FKN Systek, Inc. --- 3 Blade N100 Nibbler

Industry News | 2019-09-06 14:46:04.0

THREE BLADE CHOICES FOR SINGULATING RECTANGULAR TAB ROUTED PCBS CLEANLY SINGULATE STANDARD AND FLEX CIRCUIT PANELS WITHOUT DUST Cleanly

FKN Systek

IPC Workshops Highlight Updates to Key Industry Standards: IPC-A-610, J-STD-001, and IPC-A-600 and IPC-6012

Industry News | 2010-04-19 12:56:32.0

BANNOCKBURN, Ill., USA, - The world’s most widely used standards for printed boards and electronic assemblies were recently updated, providing new coverage for advanced technologies and processes as well as guidance on the new challenges that state-of-the-art can bring. To help industry members understand the ramifications of the changes to the standards that they and their customers depend on, IPC will host a number of full-day technology workshops, taught by the leaders of the task groups that worked on the standards’ revisions.

Association Connecting Electronics Industries (IPC)

Changes in Key Electronics Manufacturing Standards Focus of Half-day Workshops at Electronics Midwest

Industry News | 2010-08-25 14:54:48.0

Industry experts will shine the spotlight on recent revisions to key electronics manufacturing industry standards and guidelines during IPC’s professional development program at Electronics Midwest. On September 27 and September 29–30, half-day, in-depth workshops will address major updates to the standards that establish electronics manufacturing requirements and acceptability criteria worldwide. In addition, a workshop covering industry best practices, new and emerging developments and future trends in materials and processes for packaging and assembly will be offered.

Association Connecting Electronics Industries (IPC)

IPC-A-610E Released: Industry Requirements for Acceptability of Electronic Assemblies Updated.

Industry News | 2010-04-10 02:16:34.0

IPC has released the E revision of IPC-A-610, Acceptability of Electronic Assemblies. IPC's most widely-used standard, which provides visual acceptance criteria for post assembly mechanical and soldering assembly requirements, now addresses additional technologies, including flexible circuits, board in board, package on package, depanelization and additional SMT terminations.

Association Connecting Electronics Industries (IPC)

LIVE ELECTRONICS ASSEMBLY LINE FEATURED AT ELECTRONICS MIDWEST

Industry News | 2010-09-02 16:09:40.0

Each step in the electronics assembly process will be on display and fully functioning on the show floor at Electronics Midwest, produced by IPC — Association Connecting Electronics Industries® and Canon Communications.

Association Connecting Electronics Industries (IPC)

BEST Installs New Laser System for PCB Depaneling, Hole Drilling, Selective Ablation

Industry News | 2015-10-21 17:02:27.0

Product lead time reductions and increased capabilities for EMS providers and board shops

BEST Inc.

A-Laser to Highlight UV Laser Depaneling at SMTA International 2011

Industry News | 2011-09-21 14:32:19.0

A-Laser will highlight UV laser depaneling of rigid and flex materials in Booth #206 at the upcoming SMTA International Conference & Exhibition

A-Laser, Inc.

A-Laser to Highlight Laser Depaneling at MD&M West 2012

Industry News | 2012-02-10 16:53:13.0

A-Laser will highlight UV laser depaneling of rigid and flex materials in booth #676 at the upcoming MD&M West Conference and Expo.

A-Laser, Inc.

LPKF Introduces New Laser for Depaneling

Industry News | 2011-06-07 14:33:33.0

LPKF has added another laser system to its repertoire. The MicroLine 1000 S presents a compact, cost-effective method for UV-laser depaneling of thin-rigid and rigid-flex assembled PCBs.

LPKF Laser & Electronics

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