Industry News | 2018-04-05 17:27:40.0
SHENMAO America today announced plans to exhibit in Booth L1101 at AutoTronics Taipei 2018, scheduled to take place April 11-14 at the Nangang Exhibition Center. The company’s new PF610-P250 solder paste, PF606-F101 solder wire and SMCW-3 cleaner are designed for automotive applications.
Industry News | 2015-08-26 17:06:29.0
KIC today announced that it will showcase the KIC Auto-Focus Power in Booth #338 at SMTA International, scheduled to take place Sep. 29 - 30, 2015 at the Donald Stephens Convention Center in Rosemont, IL. The KIC Auto-Focus Power provides a recommended oven setup for a new assembly before running a single profile.
Industry News | 2017-02-12 13:13:51.0
Koh Young Technology will exhibit its world-leading 3D AOI and SPI solutions with the new theme ‘True 3D now powered by Intelligent Platform for Smart Factory’ in Booth #801 at IPC/APEX next week in San Diego, California, USA.
Industry News | 2016-10-12 18:32:31.0
Yamaha Motor Corporation, USA announces new developments in software features and functions for its Modular Mounters (SMT placement systems) that improve productivity and simplify maintenance. These include improvements in Nozzle Health Care, Maintenance Monitor, e-Vision, and a New Grouping optimization.
Industry News | 2024-09-16 19:05:27.0
Kurtz Ersa Inc. is pleased to announce that it won two Mexico Technology Awards. The Auto Scavenger Module for the Ersa Rework System HR 600 XL won in the Rework & Repair category while the HOTFLOW THREE won in the Soldering Equipment – Reflow category. The awards were announced during a ceremony that took place on Wednesday, September 11, 2024 during SMTA Guadalajara in Mexico.
Industry News | 2020-01-07 11:51:03.0
CyberOptics® Corporation will showcase its SQ3000™ Multi-Function for AOI, SPI and CMM in Booth #3113 at the 2020 IPC APEX EXPO, scheduled to take place Feb. 4-6, 2020 at the San Diego Convention Center in California. Additionally, CyberOptics will demonstrate the latest 3D AOI software with ultra-fast programming capabilities, auto tuning and enhancements that significantly speed setup, simplify the process, reduce training efforts and minimize operator interaction.
Industry News | 2020-07-27 11:12:23.0
Columbus, Ohio - Engineered Vision announces the release of the Flex-Bot: A New Generation of Vision Flex Feeding Technology! The Flex-Bot provides a solution to a previously unsolved manufacturing dilemma of high mix part feeding. This limitation has stifled manufacturers ability to automate, leaving manual labor in charge of dull and monotonous part feeding for anything less than ultra-high volume. The Flex-Bot offers an alternative to ultra-high volume single part bowl feeders with multiple part flexibility and additional orientation capability through robotic placement. With a standard hardware and software platform, there has been a greater than 40% reduction in engineering hours required to develop a custom application, and those savings are being passed on to the customer. With the ability to quickly adapt to an immense range of parts through Vibratory & Smart Auto-Tuning Technology as well as a point and click user interface, the Flex-Bot is the solution for today's current projects and tomorrow's ambitions.
Industry News | 2016-02-18 08:29:26.0
ViTrox Technologies today announced that it will exhibit in Booth #1023 at the 2016 IPC APEX EXPO, scheduled to take place March 15-17, 2016 at the Las Vegas Convention Center. ViTrox's new products – V310 3D SPI and V-One will be highlights of the day!
Industry News | 2009-03-19 15:03:23.0
MINNEAPOLIS - March 2009 - CyberOptics Corporation (Nasdaq: CYBE) announces that it will highlight its Flex High-Resolution automated optical inspection system (AOI) in booth 2071 at the upcoming APEX 2009 exhibition and conference, scheduled to take place March 31-April 2, 2009 at in Las Vegas.
Industry News | 2011-09-01 21:06:44.0
Multitest announces that its MT2168 has proven its superior placement concept at a high-volume production site in Asia. The customer experienced a significant improvement in the placement rate of tested devices in the output tray.
