Industry News | 2018-10-18 09:37:27.0
How To Set Profile In SMT Reflow Oven
Industry News | 2009-06-05 07:47:18.0
Paul Nickelsberg, spoke at MDG Forum: Why medical devices fail and what you need to do to prevent it from happening
Industry News | 2018-01-29 10:00:54.0
HOUSTON, TX-Jan. 29, 2018-Pick and place errors account for the majority of quality issues when programming small devices. Pick and place inaccuracy occurs when the machine is not taught precisely. Teaching the machine manually is nearly impossible for small devices, and for larger devices operator skill and experience are required. Programming centers and manufacturers programming small devices incur added costs for labor, machine idle time, lost devices, damaged devices, escapes and poor yield. BPM invented WhisperTeach™, patent pending, to help programming centers and manufacturers reduce setup time per job, improve cycle time, reduce changeover time, and improve job accuracy. WhisperTeach™ uses artificial intelligence and an enhanced pneumatic system to learn and determine the accurate z-height between the nozzle and device.
Industry News | 2009-08-04 16:58:23.0
As components get smaller and smaller, managing moisture-sensitive devices and protecting them across the entire supply chain is becoming increasingly important for electronics manufacturers. The goal is to prevent the use of moisture-damaged components at the very start of the SMD process chain.
Industry News | 2008-04-07 23:18:22.0
MORRISVILLE, NC - March 31, 2008 - Juki Corporation, a world-leading provider of automated assembly products and systems, announces that its OPASS technology won a NPI Award in the Software category. The award was presented to the company during a Monday, March 31, 2008 ceremony that took place in the Mandalay Bay Resort & Convention Center in Las Vegas before the start of APEX 2008. OPASS, which stands for Offset Placement After Solder Screen Printing, was developed to address the problem of solder paste alignment errors.
Industry News | 2015-10-21 17:15:18.0
Fancort Industries, Inc. will exhibit in Hall B2, Booth 389 at the productronica International Trade Fair, scheduled to take place Nov. 10-13, 2015 at the Messe München exhibition center in Munich, Germany. Fancort is a leader in the design and fabrication of lead forming and cutting equipment, primarily for SMDs and some through-hole applications. The company will showcase its wide selection of equipment and services designed to meet all requirements from prototype to moderate production, specializing in processing high-reliability aerospace grade devices to exacting SMT tolerances. Fancort will display its standard line of SMT products, including:
Industry News | 2019-01-04 15:40:38.0
Inovaxe is pleased to announce plans to exhibit at the 2019 IPC APEX EXPO, scheduled to take place Jan 29-31, 2019 at the San Diego Convention Center in California. The Inovaxe team will showcase the new SMART InoMechanical storage solution, as well as its new SMART SREX stationary storage solution in Booth #3417.
Industry News | 2008-04-08 22:36:16.0
MORRISVILLE, NC - April 2, 2008 - Juki Corporation, a world-leading provider of automated assembly products and systems, announces it was named as a first finalist for its OPASS technology in the Design and Manufacturing Software category during the VISION Awards announcement ceremony that took place Wednesday, April 2, 2008 in Las Vegas during APEX 2008. OPASS, which stands for Offset Placement After Solder Screen Printing, was developed to address the problem of solder paste alignment errors.
Industry News | 2008-04-08 23:53:03.0
MORRISVILLE, NC - April 2008 - Juki Corporation, a world-leading provider of automated assembly products and systems, announces that it won a 2008 SMT China Vision Award for its OPASS technology in the Software - Production category during an awards ceremony that took place April 8, 2008 at the Shanghai Everbright Convention & Exhibition International Hotel during NEPCON China/EMT China. OPASS, which stands for Offset Placement After Solder Screen Printing, was developed to address the problem of solder paste alignment errors.