Industry News: heater and element (Page 19 of 22)

Kurtz Ersa Inc. Is 20 Awards Strong

Industry News | 2022-09-26 06:40:41.0

Kurtz Ersa Inc. today announced that it was awarded a 2022 Mexico Technology Award in the category of Repair and Rework for its HR 550 XL Hybrid Rework System. The award was announced during a ceremony that took place Wednesday, Sept. 21, 2022 during SMTA Guadalajara in Mexico. With the 2022 Mexico Technology Award, Ersa adds its 20th award to its repertoire.

kurtz ersa Corporation

Nordson MARCH Receives Vision and Innovation Awards at NEPCON China for its RollVIA Self-contained Vacuum Plasma System

Industry News | 2018-05-31 10:23:37.0

Nordson MARCH announces that it has received the VISION Award from SMT China magazine and the Innovation Award from Electronics Manufacturing (EM) Asia magazine for its new-generation RollVIA™ plasma system. The awards were presented at NEPCON China, held in the Shanghai EXPO World Center, Shanghai, China, on April 24 and 25, 2018. The RollVIA™ plasma system is used for plasma applications such as surface activation for improved adhesion, carbon removal and descum/desmear for cleaner surfaces, and etchback, which removes a slight amount of dielectric contamination between internal copper planes during printed circuit board (PCB) production. The RollVIA provides uniform plasma treatment of substrates as thin as 25 microns.

MARCH Products | Nordson Electronics Solutions

Data I/O Presents “IoT Security: The Topic Most Talked About and Least Acted Upon” at the IoT Device Security Summit

Industry News | 2018-10-30 20:09:45.0

Data I/O Corporation will join industry leaders at the upcoming IoT Device Security Summit to discuss best practices for designing and securing IoT devices. Data I/O will present “IoT Security: The Topic Most Talked About and Least Acted Upon – How Any OEM Can Get Started” and participate in a panel made up of security industry leaders. The IoT Device Security Summit takes place on Tuesday, October 30th at the Hyatt Regency in Santa Clara, CA.

Data I/O Corporation

KYZEN to Present Keynote on Strengthening E-Mobility Infrastructure at SMTA High Reliability Cleaning and Conformal Coating Conference

Industry News | 2023-08-07 10:22:05.0

KYZEN is excited to announce its participation in the SMTA High Reliability Cleaning and Conformal Coating Conference. The event is scheduled to take place Aug. 29-31, 2023 at The Westin Dallas Fort Worth Airport in Texas. KYZEN's Debbie Carboni and Ram Wissel, in cooperation with Brian Chislea from Dow Chemical and Brian O'Leary from Indium Corporation, will present the keynote "Strengthening E-Mobility Infrastructure: Overcoming High-Voltage and Environmental Challenges."

KYZEN Corporation

A multifunctional printed circuit board, integrating sensor and evaluation electronics, has passed initial customer production release tests

Industry News | 2009-04-23 21:31:21.0

W�rth Elektronik's cantilever sensors revolutionise applications such as ERP and identification systems

Würth Elektronik GmbH & Co. KG

Perllo Technologies Introduces Extec�s new line of Steel-Inked and 3-D Thick Film Hybrid Technology into US Marketplace

Industry News | 2004-11-19 15:47:39.0

Perllo Technologies LLC is pleased to announce its new partnership with Extec Integrated Systems Limited ("Extec") of Hampshire, United Kingdom.

Perllo Technologies

Henkel Launches High-Lead and Lead-Free Capable Die Attach Solder Paste for Enhanced Thermal Control of Power Devices

Industry News | 2009-07-24 13:38:04.0

To address the thermal requirements posed by smaller outline, higher functioning power semiconductor devices, Henkel has formulated an advanced die attach solder paste suitable for both high-lead and lead-free applications.

Henkel Electronic Materials

Orbotech Receives Major Multi-Million Dollar Order for LDI and AOI Systems from Endicott Interconnect Technologies- Manufacturer Now Largest User of LDI Technology in the Americas

Industry News | 2007-05-30 17:19:09.0

Billerica, MA � May 24, 2007. Orbotech, Inc., the North American subsidiary of Orbotech Ltd., today announced jointly with Endicott Interconnect Technologies, Inc. (EI) that the advanced electronic interconnect supplier has placed a major multi-million dollar order for Orbotech laser direct imaging (LDI) and automated optical inspection (AOI) equipment for use in production at its facility in Endicott, NY, USA.

i3 Electronics

Europlacer iineo II Pick-and-Place Technology Doubles SMT Production Capacity for BGM Engineering iineo-II offers best value and technology for high-mix manufacturing requirements

Industry News | 2012-04-10 16:06:44.0

The iineo II pick-and-place equipment from Europlacer has doubled SMT production capacity for Detroit-based BGM Engineering.

EUROPLACER


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