Industry News | 2023-03-16 14:42:07.0
SHENMAO America, Inc. has released its new Anti-HoP Lead-Free Solder Paste PF606-P130N. The paste is specially designed for the SMT process to prevent head-on-pillow (HoP) issues.
Industry News | 2023-11-22 09:14:45.0
Welded Vs. Seamless Steel Pipe
Industry News | 2019-12-16 22:42:05.0
T1 is a multi-function placement machine, also a submicron flip eutectic placement machine, providing placement accuracy up to 5 microns, suitable for all kinds of flip chip, common chip mounting, can handle the minimum chip spacing as low as 50 microns.
Industry News | 2008-02-29 16:42:42.0
ITASCA, IL � January 7, 2008 � Kester will provide lead-free resources, technologies and products in booth 1660 at the upcoming APEX 2008 exhibition and conference, scheduled to take place April 1-3, 2008, in Los Vegas.
Industry News | 2009-04-21 13:02:34.0
Essemtec Switzerland has announced that as of April 2009, its new subsidiary Essemtec Benelux will be responsible for all activities of the Swiss SMT equipment supplier regarding Belgium, Netherlands and Luxembourg. The first official presentation will be at the Electronics & Automation exhibition in Utrecht (27th � 29th of May 2009).
Industry News | 2013-10-08 16:27:28.0
Essemtec, the Swiss manufacturer of production systems for electronic assembly and packaging, will highlight its newest machines in Hall A3, Stand 341 at the 20th international productronica international trade fair, scheduled to take place November 12 - 15, 2013 at the New Munich Trade Fair Centre in Munich, Germany.
Industry News | 2007-11-01 20:33:22.0
ITASCA, IL � November 1, 2007 � Kester announces it will launch the new EnviroMark 919G (EM919G) lead-free solder paste in Hall A4, Stand 363 at the upcoming Productronica 2007 exhibition and conference, scheduled to take place November 13-16, 2007 at the Munich Trade Fair Center in Munich, Germany.
Industry News | 2008-03-01 17:46:50.0
Breda, Holland -- Cobar BV, a member of the Balver Zinn Group, announces the introduction of XF3 lead-free solder paste, developed to accommodate extended reflow profiles without the use of nitrogen. XF3 completes the family of Cobar products based on Nihon Superior�s patented SN100C-alloy.
Industry News | 2008-03-10 14:49:28.0
Breda, Holland -- Cobar BV, a member of the Balver Zinn Group, announces the introduction of XF3 lead-free solder paste, developed to accommodate extended reflow profiles without the use of nitrogen. XF3 completes the family of Cobar products based on Nihon Superior�s patented SN100C-alloy.
Industry News | 2009-04-08 15:48:25.0
DENVER � April 2009 � Krayden, Inc., a leading distributor of engineered materials and Dow Corning's Distributor of the Year, announces that it will exhibit technologies from its industry-leading suppliers in booth 1141at the upcoming NEPCON East Exhibition and Conference, scheduled to take place April 22-23, 2009 at the Boston Convention & Exhibition Center in Boston, MA.
