Industry News: how long can you leave solder paste? (Page 2 of 3)

Why use Via in Pad Design?

Industry News | 2019-11-05 22:08:21.0

Via in pad is the design practice of placing a via in the copper landing pad of a component. Compared to standard PCB via routing, via in pad allows a design to use smaller component pitch sizes and further reduce the PCBs overall size. With component manufactures pushing smaller parts every year and the demand from consumers for smaller devices, the usage of via in pad practices by hardware engineers have become more commonplace. In this article, we will discuss the differences between via in pad and traditional vias, when should you use via in pad, and how to design for it.

Headpcb

AIM Solder to Exhibit NC259 Solder Paste at SMT Hybrid Packaging 2013

Industry News | 2013-03-18 17:06:13.0

AIM Solder announces that it will highlight its new NC259 Solder Paste in representative smartTec GmbH’s booth, which is located in Hall 7, Booth 219 at the upcoming SMT Hybrid Packaging exhibition and conference, scheduled to take place April 16-18, 2013 at the Messezentrum in Nuremberg, Germany.

AIM Solder

AIM to Showcase NC259 Solder Paste at the 2013 Del Mar Show

Industry News | 2013-04-01 09:02:49.0

AIM Solder today announced that it will highlight its new NC259 Solder Paste in Booth #554-556 at the Del Mar Electronics & Design Show (DMEDS), scheduled to take place May 1-2, 2013 at the Del Mar Fairgrounds in San Diego, CA

AIM Solder

Plan your engineering process improvement with a monthly online webinar

Industry News | 2017-04-13 06:06:32.0

Solderability Benchmarking, Failures & Testing Methods 14th August All our webinars are based on 2.30pm UK time go to https://www.bobwillis.co.uk/events/ Benchmarking you PCB surface finish or the impact of baking boards or components can be simple in production and the laboratoy. Long term solderability of component terminations and printed circuit boards is fundamental in modern assembly processes. This is all practical experience not just theory for the presenters countless studies in industry

ASKbobwillis.com

Indium Corporation Features Indium3.2HF Pb-Free Water-Soluble Solder Paste at Productronica China

Industry News | 2016-02-18 00:22:10.0

Indium Corporation will feature Indium3.2HF water-soluble solder paste at Productronica China on March 15-17, 2016, at the Shanghai New International Expo Centre in Shanghai, China.

Indium Corporation

Indium Corporation to Present on e-Mobility at SMTA Michigan

Industry News | 2022-04-20 14:44:31.0

Indium Corporation's Brian O'Leary, global accounts manager and global head of e-Mobility and infrastructure, will be presenting on market trends in the thriving electric vehicle (EV) landscape at the SMTA Michigan Expo & Tech Forum at 9 a.m. local time, Tuesday, May 17, Livonia, Mich., U.S.

Indium Corporation

AIM Solder Accepts 2013 NPI Award for Its New NC277 VOC-Free Flux at the IPC APEX EXPO

Industry News | 2013-02-21 07:01:08.0

AIM Solder today announced that it has been awarded a 2013 NPI Award in the category of Flux for its NC277 No-Clean Liquid Flux.

AIM Solder

AIM Solder to Highlight NC277 No-Clean Flux at the IPC APEX EXPO

Industry News | 2013-01-15 16:31:41.0

– AIM Solder announces that it will highlight its new NC277 No-Clean Liquid Flux at the upcoming IPC APEX Expo,

AIM Solder

User-friendly inspections of protective coatings with the S3088 CCI system by Viscom

Industry News | 2018-11-14 15:25:28.0

Over the years, humidity, moisture or extreme temperature fluctuations can adversely affect electronic assemblies. To ensure that PCB assemblies work faultlessly for a long time, certain areas can be given conformal coatings during production. At the electronica trade show in Munich from November 13-16, Viscom AG offers a comprehensive look at how easily the inspection of these coatings works with the S3088 CCI system.

Viscom AG

Koh Young Helps PCBX Digitally Transform its Manufacturing

Industry News | 2020-01-29 13:29:02.0

Atlanta, Georgia – Koh Young is delighted to announce the release of a new case study exploring how a low volume contract manufacturer with an almost fanatical approach to quality used automated solder paste inspection (SPI) to improve the performance of their printing and of their whole process.

Koh Young America, Inc.


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