Industry News | 2018-10-11 19:55:58.0
Aegis Software and Inovaxe have teamed up to provide an integrated solution that delivers ultra-lean material handling, storage, and production capabilities. This complementary combination will help manufacturers improve productivity, reduce labor and inventory costs, maximize yield, optimize floor space, and minimize unplanned downtime, ultimately increasing quality, revenues, and customer satisfaction.
Industry News | 2015-08-23 14:25:07.0
Engineered Material Systems, will showcase its 561-403 Conductive Adhesive at the EU PVSEC show, scheduled to take place September 15-17, 2015 in Hamburg, Germany. EMS 561-403 is a snap cure, low cost conductive adhesive designed for Heterojunction (HIT) and Multi Bus Bar silicon solar modules.
Industry News | 2014-08-12 13:50:53.0
Indium Corporation's Wisdom Qu, assistant technical manager, and Fengying Zhou, research chemist, will present at the SMTA China South Conference Aug. 26-28 in Shenzhen, China.
Industry News | 2010-09-28 03:14:02.0
KIC, the leader of thermal process development and control products, and winner of multiple industry awards, will highlight its MVP profile fixture in booth 201 at the upcoming SMTA International, scheduled to take place October 24 - 28, 2010 at the Walt Disney World Swan and Dolphin Resort in Orlando, FL.
Industry News | 2018-10-11 19:38:14.0
SEHO Systems GmbH will highlight the SelectLine-C at Matelec, scheduled to take place Nov.13-16, 2018 at the Feria de Madrid in Spain. SEHO’s representative for Spain and Portugal, Propelec S.A. will demonstrate one of the basic modules of the SelectLine-C that features the highest flexibility with outstanding low space requirements in booth #2B01.
Industry News | 2018-10-18 08:34:52.0
How to Prevent Solder Bridging in 3528 PLCC6 RGB LEDs?
Industry News | 2018-10-18 11:28:01.0
How to Generate Gerber Files Using Altium Designer
Industry News | 2016-03-03 10:33:15.0
Indium Corporation's Sze Pei Lim, Semiconductor Product Manager for Asia, will present at SEMICON China. Lim's presentation, No-Clean Material for Advanced Packaging Assembly, will detail how semiconductor-grade, ultra-low residue, no-clean fluxes and solder pastes eliminate the need for multiple cleaning steps in the system-in-package (SiP) assembly process.
Industry News | 2014-10-08 21:22:35.0
Indium Corporation's Dr. Ning-Cheng Lee, vice president of technology, will share his expertise at the 11th Annual International Wafer-Level Packaging Conference (IWLPC) Nov. 11-13 in San Jose, Calif. Dr. Lee's tutorial, Achieving High Reliability Lead-Free Soldering - Materials Considerations, will take place Nov. 13 from 1:30-5:00 p.m.
Industry News | 2021-04-13 17:37:07.0
Gold plating dissolves rapidly during soldering and can result in gold embrittlement. This tech paper examines how to re-condition electronic components prior to soldering.
