Industry News | 2013-08-14 09:16:16.0
FCT Assembly announces that Field Application Engineer Tony Lentz will present at the upcoming SMTA Capital Expo and Tech Forum, scheduled to take place Tuesday, September 10, 2013 at the Johns Hopkins University/Applied Physics Lab in Laurel, MD.
Industry News | 2019-11-05 22:26:14.0
The board stack-up is probably the most essential piece for ensuring a successful PCB design. Modern high-speed boards require controlled-impedance traces, and whether you are using a simulation tool, a simple calculator, or the back of a napkin, you need to understand your manufacturing process to correlate your impedance calculations. This ensures that your trace widths and dielectric heights match what will actually be manufactured, and eliminates last-minute design changes.
Industry News | 2023-09-04 13:56:51.0
Gen3, Global leader in SIR, CAF, Solderability, Ionic Contamination & process optimisation equipment, announced its participation at productronica India, the International Trade Fair for Electronics Development and Production, taking place from Sept. 13-15, 2023, at the Bangalore International Exhibition Centre (BIEC) in Bengaluru, India on booth number PE 51 in Hall 4.
Industry News | 2010-03-27 16:40:49.0
RANCHO SANTA MARGARITA, CA - Valor Computerized Systems, Inc., global provider of productivity improvement software across the printed circuit board manufacturing supply chain, announces that it will feature its latest software solutions in booth #2228 at the upcoming IPC/APEX conference and exhibition, scheduled to take place April 6-8, 2010 at the Mandalay Bay Resort & Convention Center in Las Vegas, NV.
Industry News | 2022-10-11 17:09:13.0
CyberOptics® Corporation (NASDAQ: CYBE) will exhibit at SEMICON Europa 2022, scheduled to take place November 15-18, 2022 at the Messe Munchen in Munich, Germany. The company will feature its next-generation WaferSense® Auto Teaching System™ (ATS2), the new ReticleSense® Auto Teaching System™ (ATSR) and the In-Line Particle Sensor in Booth #C1101.
Industry News | 2024-03-18 11:46:08.0
Kurtz Ersa Inc. is pleased to announce plans to showcase its latest advancements and a range of cutting-edge soldering machines at the 2024 IPC APEX EXPO. The event is scheduled to take place April 9-11, 2024 at the Anaheim Convention Center in California. Attendees can visit Kurtz Ersa at Booth #2320, with additional machinery available for viewing in Booth 2620.
Industry News | 2010-08-27 23:44:39.0
From August 31 to September 2, ATE China 2010 will be held at the Shenzhen Exhibition Center and MV, a very popular field right now, will be the focus of the exhibition.
Industry News | 2013-10-25 17:55:58.0
Nordson YESTECH,a subsidiary of Nordson Corporation (Nasdaq: NDSN) will feature the FX SL AOI in Hall A2, Stand 438 at the Productronica International Trade Fair, scheduled to take place November 12 - 15, 2013 at the New Munich Trade Fair Centre in Munich, Germany.
Industry News | 2016-09-13 21:04:26.0
Engineered Materials Systems today announced its new EMS 561-338 Fast Cure Conductive Adhesive for die attach applications with small to medium size die. EMS 561-338 is designed to cure in less than one minute at 150ºC.
Industry News | 2016-11-15 18:10:16.0
Engineered Materials Systems today announced its new EMS 561-854 Fast Cure Conductive Adhesive for die-attach applications with small- to medium-size die and tantalum capacitors. EMS 561-854 is designed to cure in one minute at 170ºC.
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